Circuit Board Segmentation for CMOS Image Sensor Noise Suppression

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Solution Overview

Problem

Existing technologies struggle to effectively suppress both hot carrier light emissions and inductive noise in solid-state image pickup apparatuses, such as CMOS image sensors, which can degrade signal quality.

Innovation Solution

A circuit board configuration with regularly arranged first, second, and third conductors, each connected to different power supplies, is used to suppress noise. This configuration includes a light-blocking structure to block hot carrier light emissions and a specific arrangement of conductor layers to mitigate inductive noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a light-blocking structure is given to wires to suppress hot carrier light emissions, then noise from hot carrier light is reduced, but inductive noise from magnetic flux may still occur

Engineering Contradiction:
Improvehot carrier light emissionsVSAvoidinductive noise
Core Design Contradiction:
Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The power supply wiring is segmented into multiple independent groups (first power supply group, second power supply group, third power supply group), each connected to different power supplies. This segmentation prevents the formation of large conductor loops and reduces magnetic flux generation, thereby suppressing inductive noise while maintaining light-blocking functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the circuit board are assigned different power supply connections. The first conductors are connected to a first power supply, second conductors to a second power supply, and third conductors to a third power supply. This local differentiation of power supply connections optimizes both light-blocking performance and inductive noise suppression in different areas.

Inventive Principle:
Principle #3Local quality

2Device complexity

If wires are arranged densely to improve circuit integration, then device complexity is reduced, but magnetic flux and inductive noise increase

Engineering Contradiction:
Improvecircuit integrationVSAvoidinductive noise
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The conductor wiring is divided into multiple segments connected to different power supplies. This segmentation allows dense arrangement of conductors while preventing the formation of large current loops, thereby maintaining circuit integration without significantly increasing inductive noise.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a third dimension of power supply connection differentiation. Instead of only arranging conductors in two spatial dimensions, it adds the dimension of power supply group assignment, allowing dense conductor arrangement while controlling magnetic flux through multi-power-supply segmentation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If a single power supply is used for all conductors, then device complexity is reduced, but inductive noise cannot be effectively suppressed

Engineering Contradiction:
Improvepower supply configurationVSAvoidinductive noise
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The power supply system is segmented into multiple independent groups (first, second, and third power supplies), each serving specific conductor groups. This segmentation enables effective suppression of inductive noise by preventing large current loops while maintaining manageable device complexity through systematic power supply assignment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the parameter of power supply voltage from a single unified voltage to multiple different voltages (first voltage, second voltage, third voltage). This parameter change allows optimization of both noise suppression and power distribution efficiency without significantly increasing device complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution effectively reduces noise in signals by blocking hot carrier light emissions and minimizing inductive noise, thereby improving the quality of images captured by solid-state image pickup apparatuses.

Implementation Method 1

there is a technology of giving a light-blocking structure to wires formed between active elements and photoelectric converting units

Methodology Applied
Scientific EffectLight-blocking: Absorption (EM radiation)

Implementation Method 2

magnetic flux passing through the conductor loop occurs as a result of a change of a current flowing through the wire, and this generates an induced electromotive force in the conductor loop

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS12266665B2Circuit board, semiconductor apparatus, and electronic equipment
Publication Date: 2025.04.01 SONY SEMICON SOLUTIONS CORP
  • US12266665B2 patent drawing
  • US12266665B2 patent drawing
  • US12266665B2 patent drawing

AI summary

The present technology relates to a circuit board, a semiconductor apparatus, and electronic equipment that are configured to make it possible to more effectively suppress the occurrence of noise in signals. A circuit board includes first conductors arranged regularly in a first direction, second conductors arranged regularly in the first direction, and third conductors arranged regularly in the first direction. A first power supply connected to the first conductors, a second power supply connected to the second conductors, and a third power supply connected to the third conductors are different power supplies. The present technology can be applied to a circuit board of a semiconductor apparatus and the like, for example.