Printed Circuit Details TRIZ Cases

A cylindrical flex circuit, irrigation chambers, and movable flow directors manage ablation heat while simplifying distal assembly.

A hinge cover and fixing members let the flexible PCB deform while hinge members prevent direct contact, noise, and wear.

See how a solid conduction path and vapor chamber share heat in thin envelopes, lowering thermal resistance and preventing dry out.

Copper nanoplate ink is deposited and sintered into lightweight EMI shields, addressing slow and costly conventional methods.

Differentially extending and compressing wave-like regions help wind elastomer sheets around curved surfaces without uneven wrinkles.

A segmented coupling layer and suction operation improve PCB adhesion to the plate layer, reducing lifting and physical interference.

This display FPC uses localized protective layers to limit corrosion while reducing warping, bounce, and stress during bending.

A segmented display module separates back films and reinforces the bendable portion to reduce bending resistance and crack risk.

This rollable display case uses a thermal path from the processor to the frame to preserve heat conduction during sliding.

This case removes the backplane card and uses passive cable routing to reduce electrical loss, space use, and complexity.

An offset flexible circuit and insulated cable bonding improve insulation and assembly in small-diameter ultrasonic endoscope tips.