Rollable Display Heat Dissipation Member Bridges Sliding Gaps

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The challenge of integrating larger displays in compact electronic devices while maintaining miniaturization and heat dissipation efficiency is unresolved, particularly in rollable devices where sliding structures create gaps that degrade heat dissipation performance.

Innovation Solution

Incorporating a heat dissipation member between the circuit board and frame in a rollable electronic device, which transfers heat generated in the processor to the frame through thermal interface materials and connection members, enhancing heat conduction efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a sliding structure is used to enable display unfolding in a rollable electronic device, then the display can be expanded or contracted, but gaps are generated between structural components which degrades heat dissipation performance

Engineering Contradiction:

Improvedisplay expansion capabilityVSAvoidheat dissipation performance

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

A heat dissipation member is introduced as an intermediary component between the circuit board and the frame. This heat dissipation member includes a heat dissipation portion that contacts the processor and a heat transfer portion that contacts the frame, creating a continuous thermal conduction path that bridges the gap created by the sliding structure. The heat dissipation member effectively mediates the thermal connection between heat-generating components and the heat-dissipating frame, resolving the heat dissipation degradation caused by sliding-induced gaps.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If the electronic device is miniaturized to improve portability, then the device size is reduced, but heat dissipation efficiency deteriorates due to limited space for heat management components

Engineering Contradiction:

Improvedevice sizeVSAvoidheat dissipation efficiency

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The heat dissipation member is integrated with the connection member that is already present in the sliding structure. By merging the heat dissipation function with the existing structural connection component, the patent eliminates the need for separate heat dissipation components, thereby saving space while maintaining effective heat dissipation. This integration allows the device to maintain miniaturization while improving heat dissipation efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The connection member is designed to serve dual functions: structural connection (enabling sliding movement) and heat dissipation. By making the connection member universal - capable of performing both mechanical and thermal functions - the patent reduces the overall component count and space requirements, allowing miniaturized device design without compromising heat dissipation efficiency.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat from the processor to the frame, reducing internal temperatures and maintaining device performance by improving heat conduction efficiency during sliding movements.

Implementation Method 1

a heat dissipation member disposed between the circuit board and the frame

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

transfers heat generated in the processor to the frame through thermal interface materials and connection members, enhancing heat conduction efficiency

Methodology Applied

Scientific EffectThermal interface conduction: Conduction (thermal)

Data Source

PatentUS20250227901A1Rollable electronic device comprising heat dissipation member

Publication Date: 2025.07.10 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device is provided. The electronic device includes a first housing having a first cover member, and a frame disposed within the first cover member, the frame including an outer surface, a second housing having a second cover member, at least a portion of which is accommodated within the first cover member, wherein the second housing is configured to slide relative to the first housing, a display configured to be unfolded based on a sliding movement of the second housing, a circuit board disposed on the second cover member and accommodating an application processor, and a heat dissipation member disposed between the circuit board and the frame.