Printable Copper Nanoplates for Lightweight EMI Shielding
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Solution Overview
Problem
Conventional EMI shielding methods are time-consuming, expensive, or result in low-quality shielding, necessitating a more efficient and cost-effective approach.
Innovation Solution
Utilizing printable copper nanostructures, particularly copper nanoplates, to create a flexible and lightweight EMI shield by depositing a layer of ink containing copper nanoplates, nanowires, and nanoparticles, followed by sintering to form a conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional EMI shielding methods are used, then shielding effectiveness is achieved, but the process is time-consuming and expensive
Solution Approach 1:
The patent changes the physical state and dimensional parameters of copper material from bulk form to nanostructured form (nanoplates, nanowires, nanoparticles). This parameter change enables the EMI shielding function to be achieved with significantly reduced material quantity and faster application process, resolving the contradiction between shielding effectiveness and application time
Solution Approach 2:
The patent segments the copper material into discrete nanostructures (nanoplates, nanowires, nanoparticles) that can be independently deposited and sintered. This segmentation allows for more efficient application processes compared to conventional bulk material methods, reducing the time required for shielding application while maintaining effectiveness
2Reliability
If conventional EMI shielding methods are used, then shielding effectiveness is achieved, but the cost increases
Solution Approach 1:
The patent changes the material parameters from bulk copper to nanostructured copper, which significantly reduces the quantity of material needed while maintaining or improving shielding effectiveness. This parameter change leads to reduced material costs and more economical manufacturing processes
Solution Approach 2:
The patent employs composite nanostructured copper materials combining different nanostructure types (nanoplates, nanowires, nanoparticles) in specific ratios. These composite nanostructures achieve high EMI shielding effectiveness with reduced material usage, lowering manufacturing costs compared to conventional bulk copper shielding
3Reliability
If conventional EMI shielding methods are used, then shielding effectiveness is achieved, but the quality is low
Solution Approach 1:
The patent changes the dimensional parameters to nanoscale dimensions for copper structures. This parameter change enables superior control over material properties, grain structure, and shielding performance, resulting in high-quality shielding that exceeds conventional methods
Solution Approach 2:
The patent segments copper into controlled nanostructures with specific size distributions and morphologies. This segmentation allows for precise control over the shielding characteristics and material properties, achieving high manufacturing precision and quality that is difficult to attain with bulk materials
4Weight of moving object
If minimal thickness is used for EMI shielding, then flexibility and weight are improved, but shielding effectiveness may be reduced
Solution Approach 1:
The patent changes the material parameters to nanostructured copper with high surface area to volume ratios and controlled conductivity. This parameter change enables the material to provide effective EMI shielding at minimal thicknesses, achieving both lightweight design and high shielding effectiveness simultaneously
Solution Approach 2:
The patent creates composite nanostructured copper materials with optimized combinations of nanoplates, nanowires, and nanoparticles. These composite nanostructures achieve enhanced shielding effectiveness per unit thickness, allowing minimal thickness designs that maintain or improve shielding performance while reducing weight
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves high EMI shielding effectiveness of up to 65 dB with minimal thickness, leveraging the conductivity and geometry of copper nanostructures for enhanced reflection and absorption.
Implementation Method 1
The electromagnetic interference shielding is observed to increase as the conductivity increases with an advantageous electromagnetic interference shielding effectiveness of 65 dB
Implementation Method 2
The geometry and conductivity effects of printed nanostructured copper on the reflection and absorption of electromagnetic interference shielding
Implementation Method 3
followed by sintering to form a conductive layer
Data Source
AI summary
A method of applying an electromagnetic interference (EMI) shield to a substrate includes depositing a layer of ink onto the substrate. The ink contains copper (Cu) nanoplates and a solvent. The solvent is evaporated from the deposited layer, and the deposited layer is sintered to form an EMI shield. In some embodiments, the ink also includes copper nanoparticles and/or copper nanowires. In another aspect, an EMI shield includes a layer of sintered copper nanoplates, and optionally, copper nanoparticles and/or copper nanowires.