Circuit Board Layout With Separate Nodes for Mixed Semiconductor Mounting
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Solution Overview
Problem
Existing technologies struggle to efficiently integrate semiconductor devices with different electrical characteristics on a single printed wiring board, as terminals with the same function may not produce predetermined outputs when connected to the same node, requiring separate configurations for each device.
Innovation Solution
A circuit board design with distinct mounting regions and nodes for semiconductor devices with different terminals, allowing for exclusive mounting and electrical connection to separate nodes, thereby accommodating devices with varying characteristics without altering peripheral components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If terminals with the same function are connected to the same node on the printed wiring board, then the circuit configuration is simplified, but semiconductor devices with different electrical characteristics cannot produce predetermined outputs
Solution Approach 1:
The patent applies local quality by providing different node configurations for different semiconductor devices on the same printed wiring board. Each semiconductor device is connected to its own dedicated node (first node for first device, second node for second device), allowing each device to receive appropriate electrical characteristics tailored to its specific requirements while maintaining overall circuit functionality.
2Reliability
If separate configurations are made for each semiconductor device with different characteristics, then proper electrical connection is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the printed wiring board into distinct mounting regions, with each region dedicated to a specific semiconductor device. Each device has its own isolated node (first node, second node, etc.) that is electrically independent from other nodes. This segmentation allows each semiconductor device to be configured according to its specific electrical characteristics while maintaining a systematic and organized manufacturing approach.
3Adaptability or versatility
If a single printed wiring board is designed to accommodate multiple semiconductor devices with different characteristics, then device versatility is improved, but the board design becomes more complex
Solution Approach 1:
The patent creates a universal printed wiring board design that can accommodate multiple types of semiconductor devices with different electrical characteristics through a standardized multi-node architecture. The board includes a first node for first semiconductor devices, a second node for second semiconductor devices, and can be extended to include additional nodes for other device types. This universal design allows the same board to support diverse devices while maintaining manageable design complexity through systematic node organization.
Data Source
AI summary
A circuit board includes a printed wiring board which includes a first mounting region on which a first component having a first terminal of a first function is mounted or mountable and a second mounting region on which a second component having a second terminal of the first function is mounted or mountable, one of the first component and the second component being exclusively mounted on the printed wiring board, and a peripheral circuit formed on the printed wiring board, wherein the peripheral circuit includes: a first node electrically connected to the first terminal, and a second node for electrically connected to the second terminal, and where the second node is a different node from the first node.