Circuit Board Heat Dissipation Solder Mask Design
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Solution Overview
Problem
Existing circuit board designs face challenges in heat dissipation due to inconsistent control of plug hole rates, leading to solder overflow and poor solder distribution, which reduces mounting accuracy and yield.
Innovation Solution
The circuit board incorporates heat dissipation holes that are formed into semi-plug holes by a bottom solder mask, which are then sealed by reinforced solder masks to prevent solder overflow and ensure accurate mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If semi-plug holes are punched to dissipate heat from the heat dissipation bonding pad, then heat dissipation effect is improved, but solder overflow and poor solder distribution occur due to inconsistent plug hole rates
Solution Approach 1:
The bottom solder mask is applied in advance to the circuit board body before the soldering process, pre-forming the semi-plug holes with controlled dimensions and shapes. This preliminary action ensures consistent plug hole rates and prevents solder overflow during subsequent soldering operations, while still achieving effective heat dissipation through the semi-plug holes.
2Temperature
If semi-plug holes are formed to achieve heat dissipation, then heat dissipation performance is improved, but mounting accuracy decreases due to solder leakage
Solution Approach 1:
The bottom solder mask acts as an intermediary element between the heat dissipation bonding pad and the external environment. It forms semi-plug holes that control solder flow, preventing solder leakage while maintaining heat dissipation pathways. The reinforced solder masks further seal the semi-plug holes to prevent solder overflow, ensuring both heat dissipation performance and mounting accuracy.
3Reliability
If reinforced solder masks are added to seal semi-plug holes, then solder leakage is prevented, but device complexity increases
Solution Approach 1:
The solder mask system is segmented into two functional parts: the bottom solder mask that forms the semi-plug holes and controls solder flow, and the reinforced solder masks that seal the semi-plug holes to prevent overflow. This segmentation allows each part to perform its specific function efficiently, preventing solder leakage while maintaining manageable structural complexity.
Data Source
AI summary
A circuit board and a display device having same. The circuit board comprises: a circuit board body (1), wherein a part mounting face (11) is formed on one side of the circuit board body (1); a base face (12) is formed on the other side of the circuit board body (1); the part mounting face (11) is provided with a heat dissipation bonding pad (2); the circuit board body (1) is provided with heat dissipation holes penetrating same from the base face (12) to the heat dissipation bonding pad (2); the base face (12) is provided with a bottom solder mask (3); the bottom solder mask (3) flows into the heat dissipation holes such that the heat dissipation holes are formed into semi-plug holes (13); reinforced solder masks (4) are arranged outside the bottom solder mask (3); and the reinforced solder masks cover the semi-plug holes in a sealing manner.