Cooling/Ventilation/Heating Modifications TRIZ Cases

Stacked modular thermal energy storage cards use phase change materials to absorb heat from electronic components.

A motor control device integrates heat transfer elements into its housing structure to dissipate thermal energy from the printed circuit board.

A liquid cooling device employs a confluence groove and liquid sensor to detect coolant leakage, preventing electronic component damage.

A thermal interface applique uses conductive gel to thermally couple heat sources and heatsinks.

A booster system adjusts temperature differentials between hot and cold fluid reservoirs to enhance cooling performance.

A thermally conductive container isolates electronic devices from liquid refrigerant, eliminating drying steps and reducing manufacturing complexity.

A flexible board bends to overlap a movable image capturing element's range while connecting circuit boards.

A dedicated duct diverts airflow from heat sinks to cool downstream components, resolving thermal bottlenecks caused by increased device size.

Support member protrudes module orthogonally to channel, directing cool air to exhaust-side components and resolving uneven temperature distribution.

A controller device switches to time-based safe mode when temperature sensors fail, alternating freecooling and direct refrigeration cycles.

Sliding distribution modules self-align fluid connectors to server chassis ports, resolving the trade-off between system flexibility and structural complexity.

An air circulation device cools the circuit through a gap between the panel and cover, preventing overheating in outdoor environments.

A hybrid rack cooling design distributes liquid to server cold plates while recirculating air to extract heat.

Segmented refrigerant branches cool power and peripheral components via a shared condenser, reducing operating costs compared to HVAC systems.

A combined air and liquid cooling system manages heat in server cabinets.

Telescoping air dams adapt to mixed card heights via spring-biased tiers, eliminating individual blockers and improving cooling across all configurations.

Segmented rack modules isolate liquid leakage risks while hybrid air-liquid systems lower power consumption for dense server loads.

Segmented housing encloses high-heat electrical components in dielectric liquid while leaving other board areas accessible.

Nested pin fins rotate into a stereoscopic configuration, reducing volume while maintaining uniform cooling coverage for inverter components.

Alternating racks and coils reduce duct area while maintaining effective cooling for high-density server environments.

Shockwave-driven movable covers seal housing openings to prevent damage while enabling fluid flow that cools subsea power semiconductors.

Bottom solder masks form semi-plug holes in circuit boards, preventing solder overflow and improving mounting accuracy.

A manifold pipe distributes coolant to multiple electronic devices in parallel, reducing installation space required for cooling infrastructure.

A two-phase immersion cooling system circulates refrigerant via thermosyphon to extract heat from processors.

Integrating a thermoelectric generator between fluid distributors captures waste heat from data center cooling systems to generate electricity.

Segmented coldplate channels coolant through inter-capacitor conduits, resolving insufficient heat dissipation in EV inverters.

A closed-loop cooling system circulates liquid through heat exchangers to stabilize air temperature within an equipment enclosure.

Snap-fitting joins the heat sink to the circuit board, removing screwdrivers from the manufacturing process and reducing production complexity.

Segmented canopy structures isolate warm exhaust air from cold supply streams, preventing thermal mixing to boost cooling efficiency.

A parallel branch cooling pipeline regulates inlet water temperature using independent regulating valves and a central controller.

Internal partitions isolate airflow between printed circuit boards, preventing hot exhaust mixing with cold supply air to maintain component temperatures.

A passive fluid conditioning system submerges electric devices in thermally conductive liquid to dissipate heat without active components.

Segmented rack cooling module with independent fans and heat exchangers resolves noise and temperature distribution trade-offs.

Predictive cooling via a bypass line reduces temperature fluctuations and extends power unit service life by anticipating thermal loads.

An integrated enclosure panel merges structural walls and cooling channels to reduce weight while maintaining thermal reliability.

A thermal testing system operates cooling devices based solely on temperature data from the component under test.

Straight diagonal and transverse coolant channels in a cooling block extract heat from impedance matching networks to prevent thermal cycling failures.

A single heat-dissipating plate merges separate attachment processes to conduct heat from multiple display modules, reducing manufacturing complexity.

Segmented fan units enable hot-swapping in storage enclosures while maintaining pressure integrity via sealing interfaces.

A securing unit uses stopper end sections passed through base seat holes to abut against the bottom side, creating a mechanical fastening structure.

A rotatable airflow guiding member separates or connects passages to manage fan noise.

Segmenting the backlight module from the display allows rotation for repair while a closed cooling circuit manages thermal accumulation.

An upper cap layer liquid prevents dielectric fluid evaporation, reducing material loss and operational costs.

A reversible fan tray cassette enables quick airflow direction changes in data center racks.

Resin tank bodies resist fluorine-series coolant permeation to maintain dimensional accuracy, reducing weight by half compared to metallic tanks.

A shutter mechanism in an air-cooled case automatically adjusts ventilation openings to manage cooling airflow.

Snap-fit retention accommodates thermal expansion mismatches between metal and plastic components, ensuring reliable environmental sealing.