Cooling/Ventilation/Heating Modifications TRIZ Cases

Stacked modular thermal energy storage cards use phase change materials to absorb heat from electronic components.

A motor control device integrates heat transfer elements into its housing structure to dissipate thermal energy from the printed circuit board.

A liquid cooling device employs a confluence groove and liquid sensor to detect coolant leakage, preventing electronic component damage.

A thermal interface applique uses conductive gel to thermally couple heat sources and heatsinks.

A booster system adjusts temperature differentials between hot and cold fluid reservoirs to enhance cooling performance.

A thermally conductive container isolates electronic devices from liquid refrigerant, eliminating drying steps and reducing manufacturing complexity.

A flexible board bends to overlap a movable image capturing element's range while connecting circuit boards.

A dedicated duct diverts airflow from heat sinks to cool downstream components, resolving thermal bottlenecks caused by increased device size.

Support member protrudes module orthogonally to channel, directing cool air to exhaust-side components and resolving uneven temperature distribution.

A controller device switches to time-based safe mode when temperature sensors fail, alternating freecooling and direct refrigeration cycles.

Sliding distribution modules self-align fluid connectors to server chassis ports, resolving the trade-off between system flexibility and structural complexity.

An air circulation device cools the circuit through a gap between the panel and cover, preventing overheating in outdoor environments.

A hybrid rack cooling design distributes liquid to server cold plates while recirculating air to extract heat.

Segmented refrigerant branches cool power and peripheral components via a shared condenser, reducing operating costs compared to HVAC systems.

A combined air and liquid cooling system manages heat in server cabinets.

Telescoping air dams adapt to mixed card heights via spring-biased tiers, eliminating individual blockers and improving cooling across all configurations.

Segmented rack modules isolate liquid leakage risks while hybrid air-liquid systems lower power consumption for dense server loads.

Segmented housing encloses high-heat electrical components in dielectric liquid while leaving other board areas accessible.

Nested pin fins rotate into a stereoscopic configuration, reducing volume while maintaining uniform cooling coverage for inverter components.

Alternating racks and coils reduce duct area while maintaining effective cooling for high-density server environments.

Shockwave-driven movable covers seal housing openings to prevent damage while enabling fluid flow that cools subsea power semiconductors.

Bottom solder masks form semi-plug holes in circuit boards, preventing solder overflow and improving mounting accuracy.

A manifold pipe distributes coolant to multiple electronic devices in parallel, reducing installation space required for cooling infrastructure.