Electronic Device Duct Cooling Airflow Downstream Component
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Solution Overview
Problem
As electronic devices with improved information processing performance generate more heat, the increased size of heat sinks to accommodate this heat leads to insufficient cooling of downstream components due to the redirection of cooling air flows, which existing cooling technologies fail to address effectively.
Innovation Solution
An electronic device design that includes a duct system to redirect a portion of the cooling air flow from the heat sink to a cooling target component positioned downstream, ensuring adequate cooling by bypassing the heat sink and improving air flow efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink size is increased to cool high-calorific components, then the cooling performance of the heat generation component is improved, but the cooling air flow becomes insufficient for downstream cooling target components
Solution Approach 1:
The cooling air flow is segmented into multiple paths: one path flows through the heat sink to cool the heat generation component, while another path is diverted through a dedicated duct to cool the cooling target component. This segmentation allows the limited cooling air flow to be distributed to multiple cooling targets effectively.
Solution Approach 2:
A dedicated duct is introduced as an intermediary structure to redirect and transport cooling air flow from the fan to the cooling target component. The duct acts as a mediator that enables the cooling air flow to reach the downstream component without being completely consumed by the heat sink.
2Temperature
If a dedicated duct is introduced to redirect cooling air flow, then the cooling of downstream components is improved, but the device structure becomes more complex
Solution Approach 1:
The dedicated duct is designed to perform multiple functions: it serves as both a structural support element and a cooling air flow channel. By integrating the duct's structural and cooling functions, the patent reduces the need for additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools high-priority components by redirecting cooling air flow, preventing overheating and maintaining system performance and reliability while minimizing structural and material changes to the board.
Implementation Method 1
a heat sink that radiates heat generated by the heat generation component
Implementation Method 2
a cooling air flow for cooling at least the heat sink
Implementation Method 3
a cooling air flow generated by a fan
Data Source
AI summary
An electronic device includes a board to which a heat generation component is attached, a heat sink that radiates heat generated by the heat generation component, a cooling target component that is between the board and the heat sink and is attached to the board, and a duct that takes in a part of a cooling air flow for cooling at least the heat sink and introduces the cooling air flow which is taken in to the cooling target component, thereby sufficiently cooling the cooling target component that is between the heat sink increased in size and the board and is positioned on a side to which the cooling air flow being applied to the heat sink flows away from the heat sink.