Manifold Pipe Cooling for Rack-Mount Servers
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Solution Overview
Problem
Rack mount-type information processing apparatuses face a reduction in mounting density due to the installation space required for liquid cooling mechanisms, which can be exacerbated by the need for separate coolant pipes and manifold configurations that occupy valuable space.
Innovation Solution
The implementation of a liquid-cooled cooling system with manifold pipes and connection hoses that supply coolant to multiple electronic devices in parallel, reducing the need for direct coolant pipe connections between liquid-cooled elements and minimizing the installation space required for cooling infrastructure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate coolant pipes are installed for each electronic device, then reliable cooling is achieved, but mounting density decreases due to increased installation space requirements
Solution Approach 1:
Multiple separate coolant pipes for individual electronic devices are merged into a single manifold pipe structure. The manifold pipe serves multiple devices simultaneously through multiple connection pipes, reducing the total number of pipes and installation space while maintaining dedicated cooling paths for each device.
Solution Approach 2:
The manifold pipe performs multiple functions: it serves as a common distribution hub for coolant to multiple electronic devices, replaces multiple individual pipe runs, and provides a standardized interface for connecting different devices. This multi-functional design reduces overall system complexity and space requirements.
2Reliability
If multiple separate coolant pipes are used for each slot, then each device receives dedicated cooling, but the cooling infrastructure occupies excessive space
Solution Approach 1:
Multiple separate coolant pipe systems are combined into a unified manifold structure. The manifold pipe integrates what would otherwise be separate pipe runs for each slot, reducing the total volume occupied by cooling infrastructure while maintaining dedicated connection pipes for reliable coolant distribution to each device.
3Reliability
If a complex manifold configuration is used to serve multiple slots, then coolant distribution is improved, but device installation becomes more difficult
Solution Approach 1:
The manifold pipe is divided into multiple standardized connection points, each serving a specific slot. This segmentation allows for modular installation where each connection can be made independently through standardized interfaces, simplifying the installation process while maintaining uniform coolant distribution across all slots.
Solution Approach 2:
The manifold pipe design incorporates standardized connection parameters and interfaces that simplify installation. By optimizing the geometric parameters of connection points and using standardized coupling mechanisms, the system achieves uniform coolant distribution without increasing installation complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains effective cooling performance while improving the mounting density of electronic elements by reducing the space occupied by cooling infrastructure and ensuring uniform coolant distribution, thereby enhancing the overall efficiency of the cooling system.
Implementation Method 1
a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element
Implementation Method 2
a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe
Data Source
AI summary
A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.