Thermally Conductive Container for Immersion Cooling

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Solution Overview

Problem

Existing immersion cooling methods require post-processing to remove adhering refrigerant and involve a drying process, complicating manufacturing and increasing time due to direct contact between electronic devices and liquid refrigerant, which limits workability and flexibility.

Innovation Solution

A cooling method using a thermally conductive sleeve in a cooling tank that immerses the electronic device in liquid refrigerant without direct contact, allowing for efficient heat transfer while maintaining the device's separation from the refrigerant, thereby eliminating the need for post-processing drying and enhancing workability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If direct immersion cooling is used, then cooling efficiency is improved, but manufacturing complexity increases due to refrigerant removal and drying processes

Engineering Contradiction:

Improvecooling efficiencyVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

A container with thermal conductivity is introduced as an intermediary between the electronic device and the liquid refrigerant. The container allows heat transfer from the electronic device to the refrigerant while preventing direct contact, thereby eliminating the need for refrigerant removal and drying processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The system is segmented into three distinct components: the electronic device, the container (which provides thermal interface), and the liquid refrigerant. This segmentation allows each component to perform its specific function independently, with the container acting as a barrier that enables heat transfer while preventing contamination.

Inventive Principle:

Principle #1Segmentation

2Use of energy by moving object

If direct immersion cooling is used, then heat transfer efficiency is improved, but manufacturing time increases due to additional drying steps

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidmanufacturing time

Core Design Contradiction:

Use of energy by moving objectVSLoss of time

Solution Approach 1:

The thermally conductive container serves as a mediator that maintains efficient heat transfer while eliminating the time-consuming drying step. By preventing direct contact between the refrigerant and electronic device, the container allows the cooling process to be followed immediately by subsequent manufacturing operations without waiting for evaporation or drying.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention skips the entire drying step by using a container that prevents refrigerant adhesion. This allows the manufacturing process to move directly from cooling to the next operation, significantly reducing total manufacturing time.

Inventive Principle:

Principle #21Skipping (Rushing through)

3Temperature

If direct contact cooling is used, then cooling performance is improved, but workability deteriorates due to refrigerant adhesion

Engineering Contradiction:

Improvecooling performanceVSAvoidworkability

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The container acts as an intermediary layer that enables effective cooling while preventing refrigerant adhesion to the electronic device. This eliminates the need for complex refrigerant removal operations and simplifies subsequent handling and assembly processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The container functions as a thin thermal interface layer that provides thermal contact while acting as a barrier to refrigerant adhesion. This flexible barrier maintains cooling performance while preventing the harmful effects of direct refrigerant contact.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method improves workability by eliminating the need for refrigerant removal and drying processes, reduces manufacturing time, and allows for the use of low-cost, high-specific heat refrigerants, while maintaining efficient cooling and versatility for various electronic device shapes.

Implementation Method 1

placing a container having thermal conductivity in a cooling tank configured to accommodate liquid refrigerant

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240324140A1Cooling method, electronic device manufacturing method, and cooling device

Publication Date: 2024.09.26 KIOXIA CORP

AI summary

A cooling method includes placing a container having thermal conductivity in a cooling tank configured to accommodate liquid refrigerant, accommodating an electronic device to be cooled in the container, and immersion cooling the container using the liquid refrigerant in a state where the electronic device remains separate from the liquid refrigerant.