Orthogonal Module Protrusion for Uniform Cooling in Electronic Apparatus

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Solution Overview

Problem

Existing electronic apparatuses face challenges in uniformly cooling multiple modules aligned with the flow direction of cooling air, leading to increased temperatures in exhaust-side modules and potential cost increases due to the need for varied heatsink heights.

Innovation Solution

The use of a support member that protrudes a module orthogonally to the flow direction, allowing it to be cooled by low-temperature air not used for upstream modules, while maintaining the same module height and preventing cost increases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If modules are arranged to be aligned on the inlet side and the exhaust side of the cooling air, then the cooling efficiency is improved, but the temperature distribution becomes uneven and the exhaust-side modules become overheated

Engineering Contradiction:
Improvecooling efficiencyVSAvoidtemperature distribution uniformity
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The invention introduces a support member that creates a local structural difference in the flow passage. This support member causes the cooling air flow to separate, with part of the air flowing above the support member and part below it. This local modification to the flow passage structure enables different regions of the modules to be cooled by air at different temperatures, specifically allowing the exhaust-side modules to be cooled by cooler air that has not been heated by the inlet-side modules, thereby achieving more uniform temperature distribution across all modules.

Inventive Principle:
Principle #3Local quality

2Temperature

If different heights of heatsinks are used to prevent thermal interference, then the cooling uniformity is improved, but the component types increase and cost increases

Engineering Contradiction:
Improvecooling uniformityVSAvoidcomponent types
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The invention segments the cooling air flow into two separate paths by introducing a support member in the flow passage. This segmentation causes the cooling air to divide, with one portion flowing above the support member and another portion flowing below it. This flow segmentation allows the exhaust-side modules to be cooled by a separate stream of cooler air, achieving uniform cooling without requiring different heatsink heights or increasing component variety.

Inventive Principle:
Principle #1Segmentation

3Temperature

If different heights of heatsinks are used to prevent thermal interference, then the cooling uniformity is improved, but the manufacturing cost increases

Engineering Contradiction:
Improvecooling uniformityVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The invention makes the support member serve multiple functions: it acts as a structural support element, a flow division device, and a thermal management component. By introducing this single support member that divides the cooling air flow, the system achieves uniform cooling across all modules without requiring multiple types of heatsinks or additional cooling components, thereby avoiding increased manufacturing costs while maintaining cooling effectiveness.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables more uniform cooling of multiple modules without increasing component types or costs, by ensuring that each module is efficiently cooled with low-temperature air, thereby optimizing the cooling process within the existing module height constraints.

Implementation Method 1

a fan 2 which flows cooling air in a flow passage R

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

a support member 5 that supports the first module 3B, and makes a portion of the first module protrude further than the second module 3A in a direction that is approximately orthogonal to the flow passage R

Methodology Applied
Scientific EffectPositioning:

Data Source

PatentUS10292312B2Electronic apparatus and server
Publication Date: 2019.05.14 CLOUD BYTE LLC
  • US10292312B2 patent drawing
  • US10292312B2 patent drawing
  • US10292312B2 patent drawing

AI summary

An electronic apparatus includes: a fan which flows cooling air in a flow passage; a plurality of modules which are arranged in the flow passage, the modules including first and second modules, the first and second modules being aligned with a flow direction of the cooling air; and a support member that supports the first module, and makes a portion of the first module protrude further than the second module in a direction approximately orthogonal to the flow direction.