Motor Control Device Thermal Management and Contaminant Protection
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Solution Overview
Problem
Existing fuel pump motor control systems face inefficiencies due to single-speed operations, and there is a need for an efficient and cost-effective controller to address these inefficiencies.
Innovation Solution
A motor control device with a printed circuit board and housing design that includes a connector for communicating control signals and power, a seal to prevent contaminants, and heat transfer elements for thermal management, allowing for efficient motor control and reduced EMC emissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-speed fuel pump motor control is used, then the device complexity is reduced, but the energy efficiency deteriorates
Solution Approach 1:
The patent implements multi-speed motor control capability that allows the fuel pump motor to operate at different speeds based on system requirements. The controller is designed to support variable speed operation, enabling optimal energy efficiency across different operating conditions while maintaining a cost-effective implementation through efficient control algorithms.
2Object-affected harmful factors
If the printed circuit board is fully enclosed in the housing, then protection from contaminants is improved, but access to connectors deteriorates
Solution Approach 1:
The housing is divided into multiple portions: a first portion that provides full enclosure and protection for the printed circuit board, and a second portion that creates a controlled opening for connector access. This segmentation allows the board to be protected while enabling necessary electrical connections through the housing structure.
Solution Approach 2:
The housing structure acts as an intermediary element that selectively transmits electrical signals through designated openings while blocking physical contaminant access. The connector passes through the housing portion, allowing electrical functionality while the housing maintains the protective barrier against contaminants.
3Temperature
If heat transfer elements are added to the housing, then thermal management is improved, but device complexity increases
Solution Approach 1:
The housing is designed to serve multiple functions simultaneously: it provides mechanical protection for the printed circuit board, enables connector access, and incorporates heat transfer capabilities. By integrating thermal management features directly into the housing structure rather than adding separate components, the design achieves effective heat dissipation while minimizing overall device complexity.
Solution Approach 2:
The heat transfer elements are merged with the housing structure itself, combining the protective enclosure function with thermal management function in a single integrated component. This integration eliminates the need for separate heat sinks or cooling components, reducing overall device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient motor control, reduces exposure to contaminants, and minimizes electromagnetic compatibility (EMC) emissions, while being cost-effective and compact enough to fit in tight spaces, such as automotive fuel pump applications.
Implementation Method 1
At least one heat transfer element on at least one of the housing or the printed circuit board facilitates heat transfer from the printed circuit board to the housing
Data Source
AI summary
An illustrative example motor control device includes a printed circuit board including electronics for motor control. At least one connector is associated with the electronics. The connector is configured for communicating at least one of control signals or power to a motor. A housing includes a first portion configured to receive the printed circuit board and cover over a first side of the printed circuit board. A second portion of the housing is configured to provide access to the at least one connector from outside of the housing. The second portion of the housing inhibits exposure of the printed circuit board to outside contaminants. A third portion of the housing is configured to cover over a second side of the printed circuit board. At least one heat transfer element on at least one of the housing or the printed circuit board facilitates heat transfer from the printed circuit board to the housing.