Pumped Loop Cooling System for Power Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional cooling methods for power electronic devices are inefficient and costly, particularly for high-power components, as they often require HVAC systems that have significantly higher operating costs compared to alternative solutions.
Innovation Solution
A pumped loop refrigerant cooling system with two branches, where refrigerant is pumped through cold plates in thermal contact with power-generating electronics and an air chiller to cool peripheral electronics, sharing a single condenser outside the container for condensation, eliminating the need for a HVAC system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If a HVAC system is used to cool air inside the container, then all electronic components (power and peripheral) can be cooled, but the operating cost becomes significantly higher
Solution Approach 1:
The cooling system is segmented into two distinct branches: a first branch with cold plates for direct cooling of power electronic components, and a second branch with an air chiller for cooling peripheral components. This segmentation allows each branch to be optimized for its specific cooling needs, eliminating the need for a complex HVAC system while reducing operating costs.
Solution Approach 2:
Different cooling methods are applied to different components based on their specific thermal requirements. Power electronic components receive direct liquid cooling through cold plates, while peripheral components receive air cooling. This local quality approach optimizes cooling efficiency for each component type separately, reducing overall system complexity and operating cost.
2Use of energy by stationary object
If conventional cooling methods are used for power electronic devices, then cooling is provided, but the operating cost is significantly higher compared to alternative solutions
Solution Approach 1:
The system uses a refrigerant-based pumped loop cooling system with hydraulic circulation. The refrigerant is pumped through the cold plates and air chiller, utilizing fluid dynamics to efficiently transfer heat from power electronic components and peripheral components to the condenser, providing effective cooling at lower operating costs.
Solution Approach 2:
The refrigerant undergoes phase transitions (evaporation and condensation) as it circulates through the system. The refrigerant evaporates at the cold plates and air chiller to absorb heat, then condenses at the condenser to release heat. This phase change process enables highly efficient heat transfer, maintaining effective cooling while reducing operating costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly reduces operational costs by effectively cooling both power and peripheral electronic components within a container, using a refrigerant that absorbs and dissipates heat outside the container, thereby minimizing HVAC system dependency.
Implementation Method 1
cold plates in thermal contact with power-generating electronics
Implementation Method 2
refrigerant that absorbs and dissipates heat outside the container
Implementation Method 3
the refrigerant is pumped through an air chiller to cool the air inside the container
Implementation Method 4
sharing a single condenser outside the container for condensing the refrigerant pumped through the system
Data Source
Figure 1
Figure 2
AI summary
A pumped-loop cooling system for cooling a plurality of heat-generating components that includes a plurality of first heat-generating components and at least one heat exchanger in thermal contact with the first heat-generating components for absorbing heat from the first heat-generating components via refrigerant flowing through the heat exchanger. The system also includes a plurality of second heat-generating components, a chiller for air-cooling the second heat-generating components, and a condenser for receiving and condensing refrigerant received from the heat exchanger and the chiller. A pump circulates refrigerant through the system. The pump receives refrigerant that has been condensed by the condenser and pumps the refrigerant to the heat exchanger and the chiller.