Rotating Heat Sink with Nested Fins for Compact Inverter Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing cooling devices face challenges in reducing size, achieving uniform cooling of multiple components, and facilitating easy assembly due to the arrangement of radiating fins outside the heat sink, which increases device size and complicates the assembly process.

Innovation Solution

A cooling device configuration featuring a first and second cooler body with pin-like blades arranged inside, allowing for rotation and assembly in a stereoscopic configuration, enabling centralized radiator units for improved cooling performance and simplified assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If radiating fins are arranged outside the heat sink, then the heat sink can be assembled, but the device size increases and uniform cooling becomes difficult

Engineering Contradiction:
Improveassembly feasibilityVSAvoiddevice size
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The radiating fins are arranged inside the heat sink structure, with fins from different heat sinks nested within each other's spatial envelope. This nesting approach allows multiple radiating surfaces to coexist in a compact configuration, reducing the overall device volume while maintaining adequate spacing for cooling airflow.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from a two-dimensional planar arrangement of radiating fins to a three-dimensional stereoscopic configuration. By arranging fins in multiple layers and orientations within the heat sink body, the design achieves compact volume while preserving cooling effectiveness through vertical and depth-based spatial utilization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If radiating fins are arranged inside the heat sink, then device size is reduced, but extremely short fin length is required to prevent interference

Engineering Contradiction:
Improvedevice sizeVSAvoidradiating performance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The heat sink assembly incorporates rotational mechanisms that allow the stereoscopic structure to transition between a flat configuration during assembly and a three-dimensional operational configuration during cooling. This dynamic transformation enables long fin lengths to be achieved without interference, as the fins are positioned in different spatial planes when rotated into place.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The heat sink is divided into multiple separable cooler bodies that can be assembled independently and then coupled together. Each cooler body contains a portion of the radiating fins, and the segmented design allows for optimized fin length and spacing within each module while maintaining compact overall dimensions when assembled.

Inventive Principle:
Principle #1Segmentation

3Adaptability or versatility

If heat sinks are coupled at 90° or 180° by fitting, then stereoscopic arrangement is achieved, but coupling must be released to transition between configurations

Engineering Contradiction:
Improvestereoscopic arrangementVSAvoidwork implementation ease
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The coupling mechanism incorporates rotational freedom that allows the heat sink modules to be assembled in a convenient flat configuration and then dynamically rotated into the final stereoscopic operational configuration. This dynamic capability eliminates the need to release and reassemble couplings, as the same coupling structure supports both assembly and operational configurations.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The coupling structure is designed to serve multiple functions: it provides mechanical connection between heat sink modules, enables rotational movement for configuration transition, and maintains structural integrity in both flat and stereoscopic arrangements. This multi-functional coupling eliminates the need for separate assembly and operational configurations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Reliability

If multiple coolers are provided to cool large number of components, then cooling coverage is improved, but device size and cost increase

Engineering Contradiction:
Improvecooling coverageVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

Multiple cooler bodies are merged into a single integrated heat sink assembly where the radiating fins of different coolers are arranged in a nested, three-dimensional configuration. This merging allows multiple cooling zones to share a common structural envelope, reducing the overall device volume while maintaining adequate cooling coverage for multiple components.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces device size, enhances cooling performance by centralizing radiator units, and simplifies assembly by allowing components to be mounted in a flat configuration before transitioning to a stereoscopic setup, improving productivity and ease of maintenance.

Implementation Method 1

The first blades each have a pin-like shape and are coupled to the first base plate. The second blades each have a pin-like shape and are coupled to the second base plate.

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a cooler for forced air cooling, a cooling fan for generating an air current to contact the cooler for forced air cooling is used in combination

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11129309B2Cooling device, lid-equipped cooling device, case with cooling device, and inverter
Publication Date: 2021.09.21 MITSUBISHI ELECTRIC CORP
  • US11129309B2 patent drawing
  • US11129309B2 patent drawing
  • US11129309B2 patent drawing

AI summary

A cooling device to be provided is capable of being reduced in size, capable of cooling a heating component uniformly, having high radiating performance, and facilitating implementation of a work in a flat state. A first cooler body includes a first base plate and first blades. The first base plate has a first component mounting surface. A second cooler body includes a second base plate and second blades. The second base plate has a second component mounting surface. With the second cooler body maintained connected to the first cooler body, a rotary mechanism allows the second cooler body to rotate relative to the first cooler body between a state in which the first component mounting surface and the second component mounting surface are pointed to the same direction and a state in which the second blades get into gaps between the first blades without interfering with the first blades.