Image Capturing Apparatus Flexible Board Heat Dissipation
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Solution Overview
Problem
Existing image capturing apparatuses face challenges in achieving sufficient heat dissipation without hindering the operation of movable image capturing elements, which can lead to malfunction or deterioration in performance, especially during high-temperature operations.
Innovation Solution
The image capturing apparatus incorporates a heat dissipation structure that includes a fan and a flexible board. The flexible board is bent to overlap with the movable range of the image capturing element in the optical axis direction, and the fan's exhaust opening is oriented towards the inner surface of the bending portion of the flexible board, ensuring effective airflow without physically connecting to the movable unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal conduction member is physically connected to the movable image capturing element for heat dissipation, then heat dissipation performance is improved, but the operation of the image capturing element is hindered
Solution Approach 1:
The patent divides the heat dissipation system into two independent parts: a stationary thermal conduction member connected to the circuit board, and a movable image capturing element that moves within a defined range. The flexible board creates a spatial separation where the bending portion overlaps with the movable range but does not physically connect to the element, allowing heat dissipation without mechanical interference with the element's operation.
Solution Approach 2:
The flexible board acts as an intermediary structure that bridges the stationary thermal conduction member and the movable image capturing element's space. Its bending portion overlaps with the movable range in the optical axis direction, creating a thermal conduction path that does not require physical connection to the moving element, thus mediating between heat dissipation requirements and operational freedom.
2Reliability
If the image capturing apparatus operates in a high temperature environment, then imaging functionality is maintained, but components may malfunction or deteriorate due to temperature rise
Solution Approach 1:
The patent implements heat dissipation structures (thermal conduction member and fan) in advance before temperature rise causes malfunction. The thermal conduction member is pre-positioned to conduct heat from the image capturing element, and the fan is ready to provide forced air cooling, preventing temperature-related failures before they occur.
Solution Approach 2:
The patent replaces natural convection with forced convection using a fan-driven air flow system. The fan creates controlled air flow through the heat dissipation structure, providing more reliable and predictable heat removal compared to passive natural convection, thereby maintaining component reliability under varying thermal conditions.
3Productivity
If natural heat dissipation is used, then device complexity is reduced, but heat dissipation amount is insufficient for high performance imaging
Solution Approach 1:
The patent combines natural convection and forced convection heat dissipation mechanisms into a single integrated system. The thermal conduction member conducts heat from the image capturing element, while the fan provides forced air flow through the same structure, merging passive and active heat dissipation approaches to achieve high heat removal capacity without requiring completely separate systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat dissipation of the image capturing element without impairing its operation, including shake correction mechanisms, thereby extending the apparatus's operational time and preventing overheating issues.
Implementation Method 1
a heat dissipation structure that uses forced air cooling by a fan
Implementation Method 2
a thermal conduction member
Data Source
AI summary
An image capturing apparatus includes an image capturing element, a first circuit board to mount the image capturing element on the first circuit board, a second circuit board facing the first circuit board, a fan, and a first flexible board electrically connect the first circuit board and the second circuit board. The image capturing element moves within a movable range in a direction different from an optical axis direction. The first flexible board is bent in an area that overlaps with the movable range of the image capturing element in the optical axis direction. When viewed from a direction orthogonal to an optical axis, an orientation of an exhaust opening of the fan is arranged toward an inner surface of a bending portion of the first flexible board closest to the first circuit board at a center position of the movable range of the image capturing element.