Circuit Board Soldering Barriers for Bubble Prevention

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Solution Overview

Problem

The existing methods for soldering highly integrated circuits to circuit boards often result in unreliable connections due to the formation of macro bubbles, leading to breakages or hairline cracks, which can cause malfunction and reduce the operating life of the circuit.

Innovation Solution

A circuit board design with multiple capture pads arranged in a rectangular or square boundary and divided soldering regions, featuring soldering barriers between adjacent pads to prevent macro bubble formation, ensuring secure solderability and minimizing heat and electrical resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering paste is applied to soldering surfaces and components are placed, then electrical connections are established, but macro bubbles form in the soldering gap causing component lifting and connection failures

Engineering Contradiction:

Improvesolder connection reliabilityVSAvoidmacro bubble formation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The soldering region is divided into multiple capture pads arranged in a rectangular or square boundary pattern. This segmentation prevents the formation of large macro bubbles by creating smaller, isolated soldering areas where gas can escape more easily, thereby maintaining connection reliability while eliminating the harmful bubble formation effect.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The circuit board design pre-establishes the capture pad arrangement and soldering region structure before the soldering process begins. This preliminary configuration ensures that when soldering paste is applied and components are mounted, the solder joints are already optimized to prevent macro bubble formation, thus improving reliability without requiring additional corrective actions during soldering.

Inventive Principle:

Principle #10Preliminary action

2Temperature

If heat conducting surfaces are soldered to circuit board, then heat transfer from integrated circuit is achieved, but heat transfer resistance increases reducing cooling efficiency

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidheat transfer resistance

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The heat conducting surface is divided into multiple capture pads arranged in a rectangular or square boundary pattern. This segmentation increases the total solder joint surface area and creates multiple thermal pathways from the integrated circuit to the circuit board, thereby reducing heat transfer resistance and improving cooling efficiency while maintaining effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

3Area of stationary object

If component size is reduced to meet installation space requirements, then installation space efficiency improves, but power density increases leading to higher thermal requirements

Engineering Contradiction:

Improveinstallation space utilizationVSAvoidpower density

Core Design Contradiction:

Area of stationary objectVSPower

Solution Approach 1:

The circuit board employs multiple small capture pads arranged in a rectangular or square boundary pattern instead of large soldering areas. This segmentation allows compact placement of high-power-density components while providing sufficient total solder joint surface area for effective heat dissipation, thus achieving both space efficiency and thermal management for high-power applications.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves a high percentage of reliable solder connections, reduces heat transfer resistance, and extends the operating life of soldering points by preventing component lifting and hot spots, while maintaining low contact resistance for better cooling and performance in power electronics.

Implementation Method 1

the volatile components of the soldering paste are vaporized in the soldering process

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

Because of the surrounding brazing solder, excess pressure is generated in the bubble and lifts the component

Methodology Applied

Scientific EffectGas pressure: Pressure Increase

Implementation Method 3

such heat outputs have to be dissipated via solder connections with a circuit carrier, for example, a circuit board

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS10327339B2Circuit board and arrangement with a circuit board

Publication Date: 2019.06.18 ZF FRIEDRICHSHAFEN AG

AI summary

The present embodiments provide a circuit board. The circuit board may comprise a first main surface, a first soldering region located on the first main surface, the first soldering region including a plurality of first capture pads for connecting the circuit board with connection pins of an integrated circuit carrier, and a second soldering region for connecting the circuit board with a heat conducting surface of the integrated circuit carrier. The first capture pads of the first soldering region may be arranged on a boundary of a rectangle or square, where the second soldering region is arranged inside the boundary, and where the second soldering region is divided into multiple second capture pads with soldering barriers formed between adjacent second capture pads.