Printed Circuit Assembling TRIZ Cases

An inert gas supply prevents oxidation and clogging in a metal jet apparatus, ensuring spherical droplet formation.

An electronic component mounting method applies adhesive to a substrate, mounts an LSI and reinforcing plate, then conveys the assembly for heat bonding.

Low temperature solder paste combined with high temperature preforms creates reliable joints through controlled dissolution during reflow processing.

Offsetting staggered dual-sided surface mount DIMM connectors separates thermal dissipation and wiring paths to mitigate interference.

An anti-scattering component minimizes radiation scattering in a resist composition, resolving the trade-off between resolution and sensitivity.

Parallel signal routing via conductive posts distributes electrical current across multiple paths to lower total resistance in flexible circuit boards.

Resin injection through pre-formed holes merges the waveguide and devices, reducing alignment complexity.

Mica sleeves constrain adhesive spread and thickness on PCBs, preventing overflow onto adjacent parts.

A wiring substrate pad design featuring a flat surface at the end of the pad body to increase contact area with semiconductor chips.

A positioning device uses sliding blocks and a ball mechanism to align electronic components within circuit board openings.

Electroplated via pillars replace laser drilling to eliminate wall roughness and tapering, ensuring reliable ultra fine pitch interconnects.

A method fills sealing resin between substrates using controlled pressure to correct warpage in electronic component integrated substrates.

Automated restricted region transform method projects 3D mechanical keepouts onto PCB surfaces to generate accurate ECAD layouts.

Automated joining tool positioning uses capacitance sensing to precisely align with flexible circuit pads.

A ceramic substrate integrates metal layers with etched pin fins for direct fluid cooling.

Snap fit features or magnetic attachments secure parts to a carrier board, eliminating manual clamping steps and maintaining positioning accuracy during reflow.

A single elongated circuit board connects adjacent display modules to eliminate exposed wiring gaps and improve manufacturing efficiency.

A package assembly uses a lead frame and solder interconnections to stack electrical components vertically.

A hybrid printed circuit board design pairs surface mount and through-hole solder pads to optimize signal transmission.

Pressure-sensitive toner bonding foil at 70°C prevents heat-induced deformation and shirt circuits in wiring substrates.

Stacking circuit boards with spacers and filling spaces with insulating resin reduces terminal width and prevents mounting errors in QFN packages.

A detachable separation layer allows circuit stack unit formation on a support substrate, reducing process complexity and warpage in thin multi-layer boards.

Multi-layer thin-film coatings provide electromagnetic shielding and adhesion to substrate layers in portable electronic devices.

A solder-resin composite bonding material reinforces semiconductor package joints to enhance mechanical strength.

Liquid resin fills individual mold cavities to encapsulate semiconductor chips, preventing cracks and warping from thermal expansion.

Protruding portions guide resin paste flow to prevent short circuits and ensure reliable electrode connections in circuit formation.

A printed circuit substrate with a recessed area thins the board to absorb external pressure and protect mounted electronic components.

A chip type electric element mounts on a flexible board land with specific length and distance ratios to reduce mechanical load.

Integrating substrate imaging with transfer paths merges operations, resolving throughput bottlenecks in printed circuit board manufacturing.

Electroplated conductive posts protrude from resin surfaces to relieve stress and prevent electrical shorts in embedded circuit patterns.

Segmented conducting layers on a flexible wiring board prevent separation from the base film during terminal protrusion formation.

Specific dimensional ratios in the tape automated bonding structure prevent outer lead detachment caused by bending stresses on curved panels.

A flexible printed circuit board reel device uses a balanced double-spring structure to distribute forces evenly across the rotary sleeve.

A component mounting device positions substrates with protruding components using optical detection and conveyance adjustment.

Segmented cross members and Z-carriage feedback detect tool center point deviations during vertical movement for precise compensation.

A circuit board uses non-solder-mask defined pads to form fine-pitch conductive structures within insulating layer openings.

A concave-convex adhesive member couples a display panel support to a circuit board, suppressing visible level differences that degrade OLED quality.

Segmented capture pads with barriers prevent macro bubbles, reducing heat resistance and extending operating life.

Dedicated substrate locating features constrain optical components via wetting dynamics, reducing assembly complexity while maintaining precision.

An integrated magnetic component embeds a nanocrystalline iron or cobalt-based soft magnetic thin film within a PCB baseboard alongside copper coils.

A metal ground bar on a stripline board functions as both electromagnetic and lightning ground.

Segmented interposer shields prevent bonding region gaps and maintain compact package size without increasing volume.

Standard solderless connectors clamp the package to a board, removing soldering complexity while maintaining electrical reliability.

A solderless electronic assembly uses reverse-interconnection to encapsulate components in insulating material with drilled vias for conductive connections.

A conducting package structure with a patterned surface controls the wetting angle of adhesive material to resolve solder defects and improve assembly yield.

A mixed alloy solder paste combines high-melting zinc particles with lower-melting tin-antimony additives to form controlled intermetallic layers.

Stepwise embedding of varying thickness components maintains structural symmetry and reduces warping in multi-layer printed circuit boards.

Compressive conductive connectors join flexible display tiles to carrier substrates, eliminating bulky cabling and maintaining uniform pixel pitch.