Recessed Printed Circuit Substrate for Stress Relief in Miniaturized Electronics
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Solution Overview
Problem
Miniaturized electronic devices are prone to damage, cracking, or deformation due to external pressure and stress, which can lead to circuit breakdown, heat generation, and potential fires, especially when ceramic condensers, resistance parts, and IC chips are mounted on printed circuit substrates.
Innovation Solution
The electronic components are mounted on a printed circuit substrate with a recessed area, where the substrate thickness is thinned, creating a more rigid bottom surface and weaker edges that absorb stress, preventing deformation and damage to the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are miniaturized to reduce device size, then device dimensions are reduced, but the components become more susceptible to damage from external pressure and stress
Solution Approach 1:
The patent applies local quality by creating a recessed portion in the printed circuit substrate specifically at the location where electronic components are mounted. This local structural modification concentrates the stress-absorbing function at the critical area, allowing the substrate to be thinner overall while providing enhanced stress protection where needed. The recessed portion has different mechanical properties (softer, more compliant) compared to the rest of the substrate, creating a localized stress relief zone that protects miniaturized components without requiring the entire device to be larger.
2Volume of moving object
If the printed circuit substrate is thinned to achieve miniaturization, then device thickness is reduced, but the substrate becomes more vulnerable to displacement and stress concentration under external pressure
Solution Approach 1:
The recessed portion acts as a pre-designed stress absorption zone that cushiones external pressure before it reaches the electronic components. By creating this compliant region in advance, the substrate can be thinner while still providing reliable stress protection. The recessed area deforms preferentially under external pressure, absorbing stress energy and preventing it from concentrating on the mounted components, thereby maintaining reliability despite reduced substrate thickness.
3Volume of moving object
If external pressure is applied to the printed circuit substrate, then device compactness is maintained, but stress concentrates on mounted components causing damage or irregular states
Solution Approach 1:
The recessed portion serves as an intermediary structure between the external pressure source and the electronic components. Instead of pressure being applied directly to the components, the recessed portion intermediates by deforming and absorbing the stress. This mediator structure protects the components from direct stress exposure, preventing damage, cracking, or irregular states while allowing the device to maintain its compact form factor.
Data Source
AI summary
According to one embodiment, provided are an electronic device and an electronic component protection substrate in which an electronic component is prevented from entering an irregular state. According to the electronic device of the present embodiment, an electronic component is soldered onto a pattern line of a printed circuit substrate, and a surface of the printed circuit substrate where the electronic component is disposed is formed as a recess such that the thickness of the printed circuit substrate in the recess part is thinned.