Embedded PCB Magnetic Core for LED Power Supply
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional magnetic components for LED power supplies face challenges in achieving high power density and efficiency due to limitations in magnetic material properties and manufacturing methods, such as low permeability of ferrite materials and inefficiencies in thin film deposition processes like electroplating and sputtering.
Innovation Solution
The integration of an iron or cobalt-based soft magnetic thin film as a magnetic core with copper coils and pins on a PCB baseboard, using methods like soft magnetic thin film deposition or melt spinning, and subsequent patterning and copper plating to create a high-performance, compact magnetic component that can function as a substrate for LED power supply circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ferrite magnetic materials are used for the core in PCB magnetic components, then the component can be manufactured with standard PCB processes, but the magnetic induction density and permeability are low, limiting power density
Solution Approach 1:
The patent uses nanocrystalline alloy materials (Fe-Si-B-Cu-Nb or Fe-Co-B-Si-Cu-Nb) with specific compositional ranges to create a composite magnetic core that combines high saturation magnetic flux density with manufacturability. The material composition is optimized to achieve Bs≥1.2T while maintaining compatibility with PCB manufacturing processes through controlled deposition and heat treatment
Solution Approach 2:
The patent changes the magnetic material parameters by controlling the deposition thickness (5-20μm per layer), heat treatment temperature (200-450℃), and holding time (30-120min) to transform the amorphous deposited layer into nanocrystalline structure, achieving high magnetic induction density while maintaining PCB manufacturing compatibility
2Loss of energy
If thin film deposition methods like electroplating are used to manufacture magnetic materials, then materials with high resistivity can be achieved, but the thickness of usable magnetic material is limited due to skin effect
Solution Approach 1:
The patent transitions from two-dimensional thin film deposition to three-dimensional powder coating and infiltration, allowing magnetic material thickness to extend beyond the skin depth limitation. The powder coating method applies insulating varnish followed by magnetic powder infiltration, creating a thick magnetic core (0.5-2mm) that avoids skin effect while maintaining high resistivity through the insulating varnish barrier
Solution Approach 2:
The patent uses porous PCB baseboard with controlled porosity (30-70%) to accommodate thick magnetic material deposition. The porous structure allows powder infiltration and resin penetration, enabling thick magnetic cores while maintaining electrical insulation through the porous network filled with insulating materials
3Loss of energy
If sputtering method is used to manufacture thin film magnetic materials, then materials with high resistivity and no skin effect limitation can be achieved, but the deposition process is slow and costly
Solution Approach 1:
The patent replaces the slow physical vapor deposition (sputtering) process with a chemical deposition approach using sol-gel or polymerization methods. The magnetic precursor solution is deposited via dip-coating or spray-coating, then heated to form magnetic oxides or carbides, achieving high resistivity materials at much higher deposition rates suitable for mass production
Solution Approach 2:
The patent changes the deposition methodology from physical vapor deposition to chemical solution deposition, using controlled chemical reactions (hydrolysis, condensation, or polymerization) to form magnetic materials. This allows rapid deposition of thick layers (micrometer to millimeter scale) with high resistivity, dramatically improving productivity while maintaining material quality
4Quantity of substance
If coreless PCB transformer is used to achieve high inductance, then a larger number of winding turns are required, but this increases resistance and affects component efficiency
Solution Approach 1:
The patent uses nanocrystalline alloy materials with high saturation magnetic flux density (Bs≥1.2T) and high initial permeability (μi≥10000) to create a magnetic core that significantly enhances inductance. This allows achieving high inductance with fewer winding turns, reducing resistance and improving efficiency while maintaining the PCB integrated structure
Solution Approach 2:
The PCB baseboard serves multiple functions: it provides the structural substrate, acts as the magnetic core support, and functions as the electrical connection network. The integrated design allows the magnetic core to be directly coupled with copper traces, eliminating separate winding processes and reducing overall resistance while achieving high inductance through the high-permeability nanocrystalline material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thin, efficient, and highly integrated magnetic component that enhances power density and reduces size, improving the reliability and manufacturing efficiency of LED power supplies while simplifying assembly and reducing costs.
Implementation Method 1
generating an iron or cobalt-based soft magnetic thin film(s) using a soft magnetic thin film deposition method or a melt spinning method
Implementation Method 2
generating an iron or cobalt-based soft magnetic thin film(s) using a soft magnetic thin film deposition method or a melt spinning method
Implementation Method 3
depositing a layer of copper on an inner side of the holes; and plating and etching the PCB
Data Source
AI summary
The present disclosure provides an integrated magnetic component, a method for manufacturing the integrated magnetic component, and an integrated LED power supply including the magnetic component. The integrated magnetic component includes a PCB baseboard, wherein magnetic core, copper coils and pins are embedded in the baseboard. The magnetic core may be an iron or cobalt-based soft magnetic thin film(s), and it may be stuck or coated on the inner layer of the PCB baseboard. Further, the copper coil may be thin copper tracks. The present disclosure provides a method for making iron or cobalt-based nanocrystalline strip(s) using a soft magnetic thin film deposition method, or a melt spinning method. The iron or cobalt-based soft magnetic thin film(s) may then be used to make an embedded PCB magnetic core. The resulting magnetic component is thin, highly efficient, and functions as a substrate in the assembly process. In addition, the LED power supply consistent with the present disclosure is thin and small, highly integrated, with process repeatability and reliability. Embodiments consistent with the present disclosure thus simplify the system assembly process for making LED power supplies, and save time and cost in the process.