Multilayer PoP Shielding Segmentation for EMI
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Solution Overview
Problem
Conventional single-layer system-in-package (SiP)/module-in-package (MiP) methods face issues with ineffective electromagnetic interference (EMI) shielding due to conductive coating materials that cannot be used where substrates are bonded and the metal can process results in larger package sizes with increased stacked structures.
Innovation Solution
A multilayer package-on-package (PoP) assembly is developed, featuring an interposer between circuit boards with a shield on its contact surfaces to surround electrical elements, and an EMI coating process is used to form a shield coating on the outer surfaces, ensuring complete shielding without increasing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional EMI coating process or metal can process is adopted for single-layer SiP/MiP, then electromagnetic interference shielding is provided, but the shielding is ineffective due to conductive coating materials not being usable where substrates are bonded
Solution Approach 1:
The patent divides the shielding structure into multiple segments: a first shield structure on the first substrate, a second shield structure on the second substrate, and a third shield structure on the interposer. This segmentation allows each shield to independently cover bonding regions without requiring the coating material to bridge substrates, thereby maintaining both EMI shielding effectiveness and bonding reliability.
Solution Approach 2:
The interposer serves as an intermediary component between the first and second substrates. It carries a third shield structure that specifically addresses the bonding interface, mediating the EMI shielding function at the critical bonding region where conventional coating processes fail. This intermediary structure enables effective shielding without compromising the bonding integrity.
2Object-affected harmful factors
If metal can process is adopted to provide EMI shielding, then shielding coverage is achieved, but the package size increases with increased stacked structures
Solution Approach 1:
Instead of applying a uniform metal can shielding structure across the entire package, the patent implements localized shield structures only where EMI protection is needed - specifically at the bonding interfaces between substrates and the interposer. This local quality approach provides adequate shielding coverage while minimizing the additional volume required, thus avoiding the size increase associated with conventional metal can processes.
3Ease of manufacture
If conventional single-layer SiP/MiP packaging is used, then manufacturing simplicity is maintained, but EMI shielding effectiveness is compromised due to bonding region gaps
Solution Approach 1:
The patent segments the EMI shielding function across three separate components (first substrate, interposer, and second substrate), each carrying its own shield structure. This segmentation enables the use of conventional, simple coating processes on each component independently, while collectively achieving complete EMI shielding coverage including the previously problematic bonding regions. The manufacturing simplicity is preserved because each component can be processed using standard techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective EMI shielding while maintaining a compact package size by ensuring all electrical elements are surrounded by the shield, preventing poor protection gaps and size increments associated with stacked substrates.
Implementation Method 1
A shield is disposed on an upper contact surface and/or a lower contact surface of the interposer in contact with the at least two circuit boards. Electrical elements on a corresponding contact surface are all surrounded by the shield.
Implementation Method 2
forming, based on an EMI coating process, a shield coating on an outer surface of the multilayer assembly and on an outer surface the interposer
Data Source
AI summary
A multilayer package-on-package (PoP) assembly and a method for packaging a multilayer assembly are provided. The multilayer PoP assembly includes at least two circuit boards. An interposer is disposed between two adjacent circuit boards of the at least two circuit boards. A shield is disposed on an upper contact surface and/or a lower contact surface of the interposer in contact with the at least two circuit boards. Electrical elements on a corresponding contact surface are all surrounded by the shield. A height of the shield is not less than a height of each of the electrical elements.