Flexible Circuit Board Parallel Signal Routing for Signal Loss Reduction
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Solution Overview
Problem
Flexible circuit boards experience significant signal transmitting loss due to their design, which affects their performance in high wiring density applications.
Innovation Solution
The flexible circuit board design incorporates a parallel connection of signal lines via conductive posts, reducing total resistance and signal loss by distributing electrical signals through multiple paths, and includes electromagnetic shielding layers to protect against external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If flexible circuit board is designed with high wiring density, then wiring capacity is improved, but signal transmitting loss increases
Solution Approach 1:
The patent divides the signal transmission path into multiple parallel segments using conductive posts that create redundant routing paths. When a signal encounters high resistance or interference in one path, it can be segmented and transmitted through alternative parallel paths, reducing overall signal loss while maintaining high wiring density.
Solution Approach 2:
The patent changes the electrical parameters of the circuit board by incorporating electromagnetic shielding layers that modify the electrical field distribution. This alters the resistance and interference characteristics of the signal paths, reducing signal transmitting loss without compromising wiring density.
2Quantity of substance
If flexible circuit board transmits high density signals, then wiring capacity is improved, but heat generation increases
Solution Approach 1:
The patent segments the current flow through multiple parallel conductive paths created by conductive posts. This distributes the current density across multiple routes, preventing concentration of heat in single high-density trace regions and thereby reducing overall heat generation.
Solution Approach 2:
The patent introduces electromagnetic shielding layers as intermediary structures that act as heat sinks and thermal management elements. These layers provide alternative thermal pathways and prevent heat buildup in high-density wiring regions.
3Shape
If flexible circuit board is made thin and flexible, then mechanical flexibility is improved, but signal shielding capability deteriorates
Solution Approach 1:
The patent employs thin-film electromagnetic shielding layers that can be integrated into the flexible circuit board structure. These thin films maintain the overall flexibility and thinness of the board while providing effective electromagnetic shielding against external interference.
Solution Approach 2:
The patent uses composite material structures combining flexible substrate materials with electromagnetic shielding layers. This creates a multi-layer composite that preserves mechanical flexibility while adding shielding capability without significantly increasing thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces signal transmission loss and heat generation, enhancing the performance and reliability of flexible circuit boards in high-density applications by minimizing resistance and protecting against external signals.
Implementation Method 1
The flexible circuit board design incorporates a parallel connection of signal lines via conductive posts, reducing total resistance and signal loss by distributing electrical signals through multiple paths
Implementation Method 2
includes electromagnetic shielding layers to protect against external interference
Data Source
AI summary
The present disclosure relates to a flexible circuit board. The flexible circuit board includes a first conductive trace substrate and a third conductive layer, a second conductive post and a third conductive post. The first conductive trace substrate includes a first insulating layer, a first conductive layer and a second conductive layer formed two opposite surfaces of the first insulating layer. The first conductive layer includes a first signal line, the second conductive layer includes a second signal line, and the first signal line is parallel connected with the second signal line.