Multi-Layer PCB Component Carrier Embedding
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Solution Overview
Problem
Existing multi-layer printed circuit boards face challenges with embedding components of different thicknesses, leading to unsymmetrical core structures, warping, and difficulties in achieving balanced resin filling and connectivity with other circuitry.
Innovation Solution
A component carrier is designed with a stepwise manufacturing method that aligns and embeds components of varying thicknesses in a symmetrical manner, using a stack of electrically conductive and insulating layers, with through-hole connections for balanced electrical connectivity, and applying pressure and heat to form a stable, compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components of different thicknesses are embedded in a multi-layer PCB structure, then component integration capability is improved, but structural symmetry and warping performance deteriorate
Solution Approach 1:
The manufacturing process is segmented into multiple sequential steps, with components being embedded in different manufacturing steps rather than simultaneously. This allows the first component to be embedded in an initial core structure, followed by additional layer formation, and then the second component to be embedded in the expanded structure. This segmentation enables handling of different component thicknesses while maintaining overall structural balance.
Solution Approach 2:
The solution transitions from a two-dimensional planar embedding approach to a three-dimensional multi-step manufacturing approach. By adding the dimension of manufacturing time and process steps, the patent enables embedding components of different thicknesses at different stages, allowing the structure to adapt and maintain symmetry throughout the manufacturing process.
2Adaptability or versatility
If components of different thicknesses are embedded in a multi-layer PCB structure, then component integration capability is improved, but resin filling performance deteriorates
Solution Approach 1:
The resin filling process is segmented and performed at different manufacturing steps corresponding to each component embedding. This ensures that resin is applied and cured in a controlled sequence, allowing proper infiltration around each component without the complications of simultaneous multi-height embedding, thereby maintaining manufacturing precision.
3Ease of manufacture
If a conventional embedding method is used for components of different thicknesses, then manufacturing simplicity is maintained, but connectivity achievement deteriorates
Solution Approach 1:
The manufacturing process is divided into sequential steps with connectivity being established at each stage. Through-holes and conductive paths are formed and populated with appropriate materials during each manufacturing step, ensuring that electrical connectivity is reliably achieved for each component as it is embedded, rather than attempting to establish all connections simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a stable, low-warping component carrier with improved resin filling and connectivity, enabling efficient embedding of components with different thicknesses and reducing manufacturing complexity.
Implementation Method 1
applying pressure and heat to form a stable, compact structure
Implementation Method 2
applying pressure and heat to form a stable, compact structure
Data Source
AI summary
A component carrier includes a first level stack of first plural of electrically conductive layer structures and/or first electrically insulating layer structures; a first component aligned within a first through hole cut out in the first level stack such that one of an upper or a lower surface of the first component is substantially flush with an respective upper or a lower surface of the first level stack second electrically conductive layer structures and/or second electrically insulating layer structures attached onto the upper and the lower surface of the first level stack thereby covering the first component at the upper and the lower surface of the first component and pressed to form a second level stack. A second component is aligned within a second through hole cut out in the second level stack such that one of upper or a lower surface of the second component is substantially flush with an upper or a lower surface of the second level stack.