Multi-Layer Board Manufacturing via Detachable Separation Layer
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Solution Overview
Problem
Current methods for manufacturing thin multi-layer circuit boards for semiconductor devices are complex and costly, resulting in products with low reliability due to the need for miniaturization in electronic components and substrates.
Innovation Solution
A method involving the formation of a detachable separation layer over a support, followed by sequential layers of solder resist, metal foil, circuit patterns, insulation, and additional solder resist, with via holes, allowing for a simple and efficient manufacturing process that separates the circuit stack unit from the support, using materials like silicone for detachment and copper clad laminate for support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional methods are used to manufacture thin multi-layer circuit boards for miniaturization, then the substrate thickness is reduced, but the manufacturing process becomes complicated and production costs increase
Solution Approach 1:
The invention divides the manufacturing process into distinct segments: forming a circuit stack unit separately on a support substrate, then detaching it as a complete unit. This segmentation allows each step to be optimized independently, simplifying the overall process while achieving thin substrate requirements
Solution Approach 2:
The circuit stack unit is formed in advance on a support substrate before final assembly. By preparing the complete circuit stack unit with all layers (solder resist, metal foil, insulation, via holes)预先 formed on the support, the actual manufacturing process is simplified and production efficiency is improved
2Length of moving object
If conventional methods are used to manufacture thin multi-layer circuit boards, then miniaturization is achieved, but reliability of the finished product decreases
Solution Approach 1:
The invention forms via holes and insulates them beforehand in the circuit stack unit before detachment. This preliminary insulation of via holes prevents potential reliability issues that could arise from exposed conductive paths, ensuring product reliability is maintained even in the thin, miniaturized structure
Solution Approach 2:
The support substrate acts as an intermediary carrier that enables precise formation of the circuit stack unit with proper via hole insulation and layer alignment. This intermediary structure ensures high reliability during manufacturing and allows for clean detachment of the finished thin circuit board
3Adaptability or versatility
If via holes are formed in the insulation part, then circuit connectivity is enabled, but manufacturing complexity increases
Solution Approach 1:
Via holes are formed and insulated beforehand in the circuit stack unit while it is still on the support substrate. This preliminary formation of via holes integrates the connectivity feature into the base structure, and subsequent insulation maintains this connectivity while preventing short circuits, thereby enabling circuit functionality without significantly increasing overall manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces costs, and enhances the reliability of the multi-layer board by ensuring symmetrical construction and effective separation, thereby improving the product's mounting reliability and minimizing warpage.
Implementation Method 1
forming a detachable separation layer over a support
Implementation Method 2
forming a plating layer over the metal foil on which the plating resist is formed
Implementation Method 3
removing the metal foil by flash etching
Data Source
AI summary
A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.