Electronic Component Production via Laminated Circuit Board Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing electronic components with quad flat no-leads package (QFN) type terminals face challenges in increasing density and efficiency due to large lead widths, leading to mounting errors and difficulties in miniaturization.
Innovation Solution
A method involving the stacking of multiple circuit boards with spacers and filling with insulating resin, followed by cutting to expose terminal portions from filled vias, allowing for reduced terminal width and increased density, while preventing mounting errors and improving production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If lead frame is used to form terminal portions, then terminal portions can be formed, but the width of terminal portions is large causing mounting errors
Solution Approach 1:
The invention divides the terminal structure into multiple segments: the lead frame provides the base terminal structure, while additional terminal portions are formed by dividing filled vias after cutting. This segmentation allows the terminal width to be reduced by using only portions of the filled vias (exposed from cut surfaces) rather than the entire lead frame thickness, thereby preventing mounting errors while maintaining electrical connectivity.
Solution Approach 2:
The invention transitions from a two-dimensional lead frame structure to a three-dimensional laminated structure with filled vias extending through multiple circuit boards. By exposing portions of these vertical filled vias from cut surfaces, the terminal portions are formed in the vertical dimension, allowing reduced width while maintaining structural integrity and electrical function.
2Quantity of substance
If single layer substrate is used, then structure is simple, but density cannot be increased
Solution Approach 1:
The invention utilizes the vertical dimension by laminating multiple circuit boards (first, second, and optionally third circuit boards) with spacers between them. This three-dimensional stacking arrangement increases component density by utilizing space in the vertical direction rather than only expanding horizontally, allowing more components to be mounted within a smaller footprint while maintaining structural organization.
Solution Approach 2:
The laminated structure nests multiple circuit boards within each other, with each board containing mounted components and interconnected through filled vias. This nested arrangement allows components to be distributed across multiple layers, effectively increasing the quantity of components (density) while containing the overall structure within a compact volume.
3Productivity
If resin molding on lead frame is used, then electronic component is formed, but production efficiency is low
Solution Approach 1:
The invention merges multiple manufacturing operations into a single integrated process: multiple circuit boards with mounted components are stacked with spacers, filled vias are formed through the laminate, and then a single cutting operation divides the filled vias to create terminal portions for multiple electronic components simultaneously. This combined approach eliminates the need for separate resin molding and individual component processing, thereby improving production efficiency while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a decrease in terminal width, preventing mounting errors, and enhances production efficiency by allowing multiple components to be produced from a single laminate, while ensuring reflow-mountability and increased density.
Implementation Method 1
filling a filling space formed between the first circuit board and the second circuit board using the spacer with an insulating resin
Data Source
AI summary
Through the use of a method of producing electronic components, a plurality of electronic components are obtained by cutting, along a predetermined cutting line, a laminate including a first circuit board and a second circuit board both mounted with circuit components. The method of producing electronic components includes: a stacking step of stacking the second circuit board on the first circuit board with a spacer interposed therewith, the first circuit board being provided with a filled via around a mounting region of the circuit components; a filling step of filling a filling space formed between the first circuit board and the second circuit board using the spacer with insulating resins; and a cutting step of cutting the laminate along the cutting line, the cutting line dividing the filled via, and exposing the filled via from a cut surface to acquire terminal portions of the electronic components.