Electronic Component Mounting Method with Integrated Adhesive Application and Bonding
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Solution Overview
Problem
Existing electronic component mounting apparatuses face inefficiencies due to separate sites for adhesive application, component mounting, and heat bonding, leading to decreased processing efficiency and increased risk of displacement of LSIs and reinforcing plates.
Innovation Solution
An integrated system where adhesive is applied and components are mounted at the same site, with a conveying device moving the substrate to a heating site for simultaneous bonding of both LSIs and reinforcing plates, eliminating the need for separate heat bonding processes and reducing substrate movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate sites are used for adhesive application, component mounting, and heat bonding, then each process can be performed with dedicated equipment, but processing efficiency decreases and substrate movement increases
Solution Approach 1:
The patent combines the adhesive application unit, mounting unit, and heat bonding device into a single integrated mounting device that operates at one location. This merging of previously separate processes eliminates the need for substrate transfer between multiple sites, thereby improving processing efficiency while maintaining dedicated functional capabilities through modular design
2Productivity
If substrate is moved between adhesive application site and component mounting site, then each process can be optimized independently, but processing efficiency decreases and displacement risk increases
Solution Approach 1:
The adhesive application unit and mounting unit are integrated to operate at the same site, eliminating substrate transfer between these two processes. This prevents displacement of components during transfer while maintaining the ability to independently control and optimize each functional unit's performance
3Productivity
If separate heat bonding processes are provided for LSIs and reinforcing plates, then each component can be bonded optimally, but processing efficiency decreases
Solution Approach 1:
The heat bonding device is designed with multi-functionality to simultaneously bond both LSIs and reinforcing plates in a single operation. This universal capability allows optimal bonding conditions to be applied to both component types while improving processing efficiency by eliminating separate bonding processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances processing efficiency by reducing substrate movement, minimizing displacement, and ensuring simultaneous and efficient bonding of components, thereby improving product quality and mechanical strength.
Implementation Method 1
a bonding device which bonds, by the application of heat, the electronic component and reinforcing plate on the substrate conveyed to the heating site by the conveying device
Data Source
AI summary
An electronic component mounting apparatus includes a mounting device adapted such that the applying unit applies adhesive to a substrate located in a predetermined site, a mounting unit mounts an LSI onto the application of the adhesive, subsequently the applying unit applies another adhesive onto the LSI, and the mounting unit mounts a reinforcing plate onto the application of the adhesive, a conveying device which conveys the substrate with the LSI and reinforcing plate mounted in the predetermined site by the mounting device to a heating site, and a heating unit which bonds, by the application of heat, the LSI and reinforcing plate on the substrate conveyed to the heating site.