Power Electronic Substrate With Integrated PinFin Cooling
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Solution Overview
Problem
Conventional power electronic substrates face challenges in achieving efficient heat dissipation and cost-effectiveness due to limitations in thermal conductivity and directional heat dissipation, particularly when using direct bonded copper (DBC) substrates with materials like alumina and PinFin plates.
Innovation Solution
A substrate design featuring a ceramic carrier with metal layers and a cooling structure formed into or over the metal layers, allowing for enhanced heat dissipation through the formation of PinFin structures via etching or other methods, enabling both single-sided and double-sided fluid cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional DBC substrates with ceramic carriers and metal layers are used, then good electrical insulation and basic heat dissipation are achieved, but heat dissipation efficiency is limited and additional heat dissipation modules are required
Solution Approach 1:
The patent merges the heat dissipation function with the substrate structure by forming metal protrusions directly on the substrate. This integration eliminates the need for separate heat dissipation modules, reducing overall device complexity while improving heat dissipation efficiency through direct thermal coupling between the metal layers, ceramic carrier, and protrusions
2Loss of energy
If external radiators with thermal paste are used for heat dissipation, then heat dissipation capability is provided, but thermal conductivity is low and additional components increase device complexity
Solution Approach 1:
The substrate structure is merged with heat dissipation functionality by forming metal protrusions that extend from the metal layers. This integration provides effective heat dissipation pathways directly within the substrate, eliminating the need for external radiators and thermal paste, thereby reducing device complexity while maintaining high heat dissipation capability
Solution Approach 2:
The metal protrusions act as thermal intermediaries that facilitate heat transfer from the metal layers through the ceramic carrier to the cooling structure. This intermediary structure provides direct thermal coupling without requiring external thermal paste or radiator components, improving heat dissipation while simplifying the overall system
3Loss of energy
If PinFin plates with soldering are used for heat dissipation, then water cooling capability is achieved, but material costs are high and heat transfer is limited by intermediate layers
Solution Approach 1:
The patent combines the heat dissipation function with the substrate structure by forming metal protrusions directly on the substrate during the substrate manufacturing process. This integration eliminates the need for separate PinFin plates and soldering operations, reducing material costs while improving heat transfer efficiency through direct thermal coupling without intermediate solder layers
Solution Approach 2:
The metal protrusions serve as thermal intermediaries that provide direct heat transfer pathways from the metal layers through the ceramic carrier to the cooling structure. This eliminates the need for solder intermediate layers used in PinFin plate configurations, improving heat transfer efficiency while reducing manufacturing complexity and cost
4Loss of energy
If conventional substrates are used, then single-direction heat dissipation is achieved, but multi-directional heat dissipation capability is limited
Solution Approach 1:
The substrate structure is segmented into multiple heat dissipation pathways by forming metal protrusions that extend in different directions from the metal layers. This segmentation enables heat to dissipate through multiple routes simultaneously - through the protrusions, along the metal layers, and through the ceramic carrier - achieving multi-directional heat dissipation while maintaining a relatively simple integrated structure
Solution Approach 2:
The patent adds vertical dimensionality to heat dissipation by forming metal protrusions that extend outward from the substrate surface. This creates three-dimensional heat dissipation pathways in addition to the planar heat flow through the substrate, enabling multi-directional heat dissipation without significantly increasing overall structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency and reduces costs by eliminating the need for additional heat dissipation modules, allowing for effective cooling on both sides of the power electronic substrate.
Implementation Method 1
a cooling structure formed into or over the second metal layer... improve heat dissipation... enabling effective thermal management... single-sided or double-sided fluid cooling
Data Source
AI summary
In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.