Solderless LED Package Connector and Heat Sink
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Solution Overview
Problem
High power LEDs generate significant heat, requiring effective heat sinking and electrical connection solutions that are not easily managed by all manufacturers due to the need for soldering technologies and precise positioning, which can be challenging without specialized equipment.
Innovation Solution
The LED package utilizes standard solderless connectors and clamping techniques for electrical connection and heat sinking, with a large metal slug for thermal contact and fiducial structures for precise positioning, eliminating the need for soldering and allowing easy lens attachment without adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solderable leads are used to connect LED package to PCB, then reliable electrical connection and heat sinking are achieved, but manufacturing complexity increases due to required soldering equipment and processes
Solution Approach 1:
The patent replaces the soldering process (thermal/chemical mechanical system) with a simple mechanical insertion system. The LED package includes built-in rigid connectors that directly mate with corresponding connectors on the PCB, eliminating the need for soldering equipment and processes while maintaining reliable electrical and thermal connections.
Solution Approach 2:
The connectors integrated into the LED package serve multiple functions simultaneously: they provide electrical connection, mechanical support, and thermal conduction pathways. This multi-functionality eliminates the need for separate soldering operations and simplifies the overall manufacturing process.
2Reliability
If solderable leads are used for LED package mounting, then electrical connection is achieved, but positioning precision deteriorates due to tolerance in soldering alignment
Solution Approach 1:
The patent replaces the soldering alignment process with a mechanical guide and alignment system. The package includes guide pins or alignment features that fit into corresponding recesses or holes on the PCB, providing precise positioning before the connectors engage. This mechanical guidance system achieves tighter tolerances than soldering alignment.
Solution Approach 2:
The alignment features (guide pins, positioning holes, or mechanical stops) are designed to engage first during the mounting process, establishing precise positioning before the electrical connectors make contact. This preliminary mechanical alignment ensures accurate LED placement relative to the PCB features.
3Ease of manufacture
If standard solderless connectors are used in LED package, then ease of manufacture improves by eliminating soldering equipment requirements, but connection reliability may deteriorate without solder bonding
Solution Approach 1:
The patent merges the electrical connector and thermal conductor into a single integrated component within the LED package. The rigid connectors are made of thermally conductive materials that simultaneously provide electrical connection and heat sinking pathways, combining multiple functions into one reliable connection mechanism that does not require soldering.
Solution Approach 2:
The connectors are constructed from composite materials or material combinations that provide both excellent electrical conductivity and high thermal conductivity. This ensures that the solderless mechanical connection achieves reliability comparable to or exceeding soldered connections, while maintaining ease of manufacture.
4Temperature
If large metal slug is used for heat sinking, then thermal conduction improves, but package weight increases
Solution Approach 1:
The patent makes the connectors multi-functional by designing them to serve both electrical connection and thermal conduction purposes. The same rigid connector structures that provide electrical pathways also serve as heat sinking pathways, eliminating the need for separate large metal heat sinking components and reducing overall package weight.
Solution Approach 2:
The electrical connection structures and thermal management structures are merged into a single integrated system. The connectors are designed with thermal pathways that conduct heat from the LED junction through the same mechanical connection that provides electrical connectivity, eliminating redundant mass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the connection and mounting process for manufacturers, ensures precise LED placement, and enhances thermal coupling to a heat-sinking board, improving reliability and ease of use for high power LEDs.
Implementation Method 1
The slug in the package thermally contacts the board to sink heat away from the LED
Implementation Method 2
The embodiments also enable a customized lens to be easily secured to the package without an adhesive... Clamping screw openings, are provided on the package for securely clamping the package to a heat sink or a heat-sinking board
Data Source
Figure 1
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Figure 4~5
AI summary
Standard solderless connectors (36, 38) extend from a molded package body (42) supporting at least one high power LED die (28). The package (26) includes a relatively large metal slug (44) extending completely through the package body (42). The LED die (28) is mounted over the top surface of the metal slug (44) with an electrically insulating ceramic submount (30) in-between the LED die (28) and metal slug (44). Electrodes (32, 34) on the submount (30) are connected to the package connectors (36, 38). Solderless clamping means, such as screw openings (52, 54), are provided on the package (26) for firmly clamping the package on a thermally conductive mounting board. The slug in the package' thermally contacts the board to sink heat away from the LED. Fiducial structures (48, 50), e.g., holes, in the package precisely position the package on corresponding fiducial structures on the board. Other packages are. described that do not use a molded body.