3D Stacked Package Assembly with Integrated Heat Sink
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Solution Overview
Problem
Current semiconductor package assemblies face challenges in minimizing volume while maintaining performance, particularly due to complex arrangements and connections among multiple dies, which can lead to increased package volume, defective connections, and poor heat dissipation.
Innovation Solution
A package assembly design featuring a lead frame connected to electrical components via solder interconnections, with an encapsulating compound exposing lead frame portions and a heat sink providing a common heat dissipation path between electrical components, allowing for direct connections and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple dice are arranged in a conventional planar configuration, then electrical connections can be established, but the package volume increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from a conventional planar (2D) arrangement of multiple dice to a three-dimensional stacked configuration. Multiple electrical components are arranged vertically on different layers, with lower layers positioned beneath upper layers. This dimensional change reduces the horizontal footprint and overall package volume while maintaining all necessary electrical connections through vertical interlayer pathways.
Solution Approach 2:
The patent combines multiple functional elements into an integrated three-dimensional structure. The lead frame serves both as the mechanical support structure and as the electrical interconnection system. Solder joints simultaneously provide mechanical attachment and electrical connectivity between dice and the lead frame, eliminating the need for separate bonding wire systems and reducing manufacturing steps.
2Temperature
If conventional packaging methods are used without integrated heat management, then manufacturing is simpler, but heat dissipation performance is poor
Solution Approach 1:
The lead frame is designed to perform multiple functions simultaneously: it provides mechanical support for the stacked electrical components, establishes electrical interconnections through solder joints, and serves as an integrated heat dissipation pathway. This multi-functionality eliminates the need for separate heat sink components while effectively managing thermal loads from multiple dice.
3Reliability
If bonding wires are used for connecting electrical components, then electrical connections can be established, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the bonding wire interconnection system from the package structure. Instead of using delicate bonding wires to connect electrical components, the design relies on robust solder joints formed directly between the dice and the lead frame. This extraction of the bonding wire function simplifies the manufacturing process, reduces assembly steps, and improves overall connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances package density by eliminating the need for bonding wires, simplifies the manufacturing process, and improves heat dissipation performance by providing a shared heat dissipation path for electrical components.
Implementation Method 1
a heat sink having a first portion arranged between at least two of the plurality of electrical components on adjacent of the at least two layers, where the heat sink is configured to provide a common heat dissipation path for the electrical components
Implementation Method 2
a lead frame connected to the electrical components by solder interconnection
Data Source
AI summary
A package assembly can include: (i) a plurality of electrical components stacked on at least two layers; (ii) a lead frame connected to the electrical components by solder interconnection; (iii) an encapsulating compound overlapping a portion of the lead frame and the electrical components to expose portions of leads of the lead frame from the encapsulating compound; and (iv) a heat sink having a first portion arranged between two of the plurality of electrical components, where the heat sink is configured to provide a common heat dissipation path for the electrical components.