Circuit Formation Using Protruding Portions for Reliable Connections

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Solution Overview

Problem

In circuit formation methods involving metal-containing liquids, ensuring reliable contact between electrodes and wiring is challenging due to uneven resin paste distribution, leading to potential short circuits or connection failures.

Innovation Solution

A method that includes forming protruding portions on a base using a curable viscous fluid, extending wiring towards these protrusions with a metal-containing liquid, applying a resin paste with different metal particles to connect the protrusions and wiring, and placing components with electrodes in contact with the resin paste, ensuring secure connections through capillary action.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If resin paste is applied to connect electrode and wiring, then connection is established, but uneven distribution of resin paste causes short circuits or connection failures

Engineering Contradiction:
Improveconnection reliabilityVSAvoidresin paste distribution uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

A protruding portion is formed on the base before applying the resin paste. This protruding portion serves as a pre-prepared structure that guides the resin paste flow and ensures proper positioning, preventing both short circuits and connection failures by establishing a controlled application path before the actual paste application occurs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The protruding portion acts as an intermediary structure between the base and the electrode-wiring connection. It provides a controlled interface that directs the resin paste to the correct location and amount, mediating the connection process to ensure reliability while compensating for variations in paste application.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If metal-containing liquid is discharged to form wiring, then circuit pattern is created, but contact between electrode and wiring cannot be ensured

Engineering Contradiction:
Improvecircuit formation easeVSAvoidelectrode-wiring contact reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The protruding portion is formed in advance on the base before the electrode and wiring are positioned. This preliminary structure creates a predetermined connection point that ensures the resin paste will properly connect the electrode to the wiring, guaranteeing contact reliability while maintaining the simplicity of the discharge-based circuit formation method.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures consistent and reliable connections between electrodes and wiring by ensuring the resin paste enters the gap between the electrode and protruding portion, preventing short circuits and connection failures while maintaining circuit integrity.

Implementation Method 1

forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Implementation Method 2

applying a metal-containing liquid containing metal particles onto the base so that the metal-containing liquid becomes conductive

Methodology Applied
Scientific EffectConductivity: Conduction (electrical)

Implementation Method 3

the connection between the electrode and the wiring is ensured by entering the resin paste between the electrode and the protruding portion

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS11849545B2Circuit formation method
Publication Date: 2023.12.19 FUJI CORP
  • US11849545B2 patent drawing
  • US11849545B2 patent drawing
  • US11849545B2 patent drawing

AI summary

A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.