Circuit Formation Using Protruding Portions for Reliable Connections
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Solution Overview
Problem
In circuit formation methods involving metal-containing liquids, ensuring reliable contact between electrodes and wiring is challenging due to uneven resin paste distribution, leading to potential short circuits or connection failures.
Innovation Solution
A method that includes forming protruding portions on a base using a curable viscous fluid, extending wiring towards these protrusions with a metal-containing liquid, applying a resin paste with different metal particles to connect the protrusions and wiring, and placing components with electrodes in contact with the resin paste, ensuring secure connections through capillary action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin paste is applied to connect electrode and wiring, then connection is established, but uneven distribution of resin paste causes short circuits or connection failures
Solution Approach 1:
A protruding portion is formed on the base before applying the resin paste. This protruding portion serves as a pre-prepared structure that guides the resin paste flow and ensures proper positioning, preventing both short circuits and connection failures by establishing a controlled application path before the actual paste application occurs.
Solution Approach 2:
The protruding portion acts as an intermediary structure between the base and the electrode-wiring connection. It provides a controlled interface that directs the resin paste to the correct location and amount, mediating the connection process to ensure reliability while compensating for variations in paste application.
2Ease of manufacture
If metal-containing liquid is discharged to form wiring, then circuit pattern is created, but contact between electrode and wiring cannot be ensured
Solution Approach 1:
The protruding portion is formed in advance on the base before the electrode and wiring are positioned. This preliminary structure creates a predetermined connection point that ensures the resin paste will properly connect the electrode to the wiring, guaranteeing contact reliability while maintaining the simplicity of the discharge-based circuit formation method.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures consistent and reliable connections between electrodes and wiring by ensuring the resin paste enters the gap between the electrode and protruding portion, preventing short circuits and connection failures while maintaining circuit integrity.
Implementation Method 1
forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid
Implementation Method 2
applying a metal-containing liquid containing metal particles onto the base so that the metal-containing liquid becomes conductive
Implementation Method 3
the connection between the electrode and the wiring is ensured by entering the resin paste between the electrode and the protruding portion
Data Source
AI summary
A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.


