Conducting Package Structure With Patterned Surface For SMT Adherence
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Solution Overview
Problem
The existing SMT technology for electronic packaging faces challenges in achieving stable and efficient high-quality production due to issues with solder defects, which are primarily related to solder-paste printing, solder quality, dispensing technique, and dot control, leading to adherence accuracy and yield problems.
Innovation Solution
A conducting package structure and manufacturing method that utilize a substrate with a patterned conducting structure conforming to the Wenzel model, where the surface roughness determines the wetting angle of the glue material, guiding its shape and position, and accelerating solvent volatilization to ensure precise and stable electronic device placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional SMT dispensing technique is used, then electronic device assembly can be completed, but adherence accuracy and yield are insufficient due to solder defects and unstable process
Solution Approach 1:
The invention changes the physical parameters of the conducting structure surface by creating a patterned surface with controlled roughness. This surface modification alters the wetting characteristics of the glue material, enabling precise control over glue spread and adhesion. The patterned surface with specific roughness parameters ensures consistent glue distribution and improves both adherence accuracy and assembly yield
Solution Approach 2:
The conducting structure surface is transformed from a uniform smooth surface to a patterned surface with localized variations in roughness. This local quality change creates specific wetting zones that control glue material behavior at critical interfaces, ensuring proper adhesion only where needed while maintaining overall process stability and yield
2Productivity
If conventional soldering process is used, then electronic devices can be assembled, but solder defects occur due to asymmetrical and lateral surface-tension forces
Solution Approach 1:
The invention modifies the surface parameters of the conducting structure by creating a patterned surface with controlled roughness. This parameter change affects the surface tension distribution of the solder and glue materials, eliminating asymmetrical forces that cause tombstoning defects. The controlled surface roughness ensures uniform wetting and stable solder joint formation, improving both productivity and joint quality
3Ease of manufacture
If smooth conducting structure surface is used, then manufacturing is simpler, but wetting angle control and solvent volatilization are insufficient
Solution Approach 1:
The invention transforms the conducting structure surface from smooth to patterned by controlling surface roughness parameters. This parameter change enables precise control over the wetting angle of glue material without significantly complicating the manufacturing process. The patterned surface achieves the desired wetting characteristics through controlled roughness rather than complex geometric patterns
Solution Approach 2:
The invention replaces complex mechanical patterning methods with a more straightforward surface treatment approach that modifies surface roughness. This substitution achieves precise wetting angle control through surface energy modification rather than through complex mechanical structures, maintaining ease of manufacture while improving manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the stability and accuracy of electronic device assembly by controlling the wetting angle and solvent diffusion, resulting in high yield and reduced prebaking time, addressing the challenges of adherence accuracy and yield in SMT technology.
Implementation Method 1
a wetting angle between the glue material and the patterned surface is determined by the patterned surface
Implementation Method 2
accelerating solvent volatilization
Data Source
AI summary
A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.