Hybrid SMT DIP PCB for USB Type-C Signal Integrity
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) using either SMT-based or DIP-based structures for USB Type-C connectors face issues with near-end crosstalk at high frequencies and difficulty in inspecting soldering defects due to blocked connection terminals.
Innovation Solution
A PCB design featuring two rows of solder pads, with all high-frequency signal transmission pads configured as SMT-based structures and at least one DIP-based structure in the second row, allowing for better inspection and improved signal transmission stability by incorporating both SMT and DIP-based structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all solder pads are configured as SMT-based structures, then signal transmission stability is improved, but inspection of soldering defects becomes difficult due to blocked connection terminals
Solution Approach 1:
The patent applies local quality by configuring different types of solder pads (SMT-based and DIP-based) in different locations based on their specific functional requirements. SMT-based pads are used where signal transmission stability is critical, while DIP-based pads are used where inspection accessibility is needed, allowing each local area to have the appropriate structure for its purpose.
2Difficulty of detecting and measuring
If all solder pads are configured as DIP-based structures, then inspection of soldering defects becomes easy, but near-end crosstalk increases at high frequencies
Solution Approach 1:
The patent resolves this contradiction by applying local quality - using DIP-based structures only in specific locations where inspection is needed and SMT-based structures in locations where high-frequency signal transmission occurs, thereby eliminating near-end crosstalk in critical signal paths while maintaining inspection accessibility where required.
3Manufacturing precision
If USB Type-C connectors are soldered with all SMT-based structures, then manufacturing precision is improved, but ease of manufacture decreases due to sequential placement requirements
Solution Approach 1:
The patent applies segmentation by dividing the solder pad configuration into different types (SMT-based and DIP-based) that can be manufactured and inspected independently. This segmentation allows different manufacturing processes to be applied to different segments, improving both precision and ease of manufacture.
Data Source
AI summary
A PCB with two rows of solder pads including both SMT-based and DIP-based structures is configured to be mounted with a USB Type-C connector by soldering, has two rows of solder pads on its top side, and is characterized in that at least one solder pad in one of the rows is a DIP-based structure while the remaining solder pads in the same row are SMT-based structures, and that all the solder pads in each row that are used to transmit high-frequency signals are SMT-based structures. Once the connector is mounted to the PCB, an inspector can directly examine the soldering quality of the DIP-based-structure solder pad and of the corresponding connection terminal simply by inspecting the bottom side of the PCB. Moreover, since all the solder pads configured for transmitting high-frequency signals are SMT-based structures, better transmission will be provided to the connector, accordingly.