Circuit Board Step Surface Mounting Electrode Alignment

The patent applies local quality by creating a recessed region in the covering layer that is positioned adjacent to the step surface. This localized modification ensures that the covering layer height is reduced in the specific area where the step surface causes excessive height, while maintaining normal height in other areas. The recessed region is designed with specific dimensional constraints (width of 0.01 mm to 0.05 mm, and length of 0.05 mm to 0.20 mm) to precisely control the covering layer height in the critical zone near mounting electrodes, thereby achieving uniform effective height for reliable mounting.

The patent implements local quality by introducing a recessed region specifically in the covering layer area adjacent to the step surface, rather than uniformly reducing the covering layer thickness throughout. This localized approach maintains the protective function in areas where full thickness is needed while creating the necessary height reduction only in the critical zone near mounting electrodes. The recessed region dimensions (0.01-0.05 mm width, 0.05-0.20 mm length) are optimized to achieve consistent mounting electrode to terminal distances without compromising overall connection security.

The patent resolves this contradiction by applying local quality through the recessed region structure. The covering layer maintains its full thickness in most areas to provide adequate protection, while a localized recessed region (0.01-0.05 mm width, 0.05-0.20 mm length) is created adjacent to the step surface. This recessed region specifically addresses the height uniformity problem in the critical zone where mounting electrodes are located, allowing the covering layer to be thick for protection elsewhere while achieving uniform effective height near mounting electrodes for precise mounting.