Circuit Board Conductive Wiring Segmentation
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Solution Overview
Problem
Circuit boards with thick copper layers require lengthy etching processes, leading to increased line space and line width, which is undesirable for improved conductivity.
Innovation Solution
A method involving multiple dry films with specific structures and thicknesses, electroplating, and etching processes to form conductive wiring layers with reduced line space and width, using cover films to fill gaps and ensure direct electrical connection between layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick copper layer is used to provide improved conductivity, then electrical conductivity is improved, but the etching process time increases and line space/width must be increased
Solution Approach 1:
The conductive wiring is divided into two separate layers: a first conductive wiring layer formed by electroplating and a second conductive wiring layer formed by etching the copper substrate. These two layers work together to provide the required conductivity while allowing each layer to be optimized independently, avoiding the need for a single thick copper layer that would require prolonged etching
Solution Approach 2:
The circuit board uses a composite conductive structure combining electroplated copper (first conductive wiring layer) and etched copper substrate (second conductive wiring layer). This composite approach allows the electroplated layer to provide initial conductivity with precise line dimensions, while the etched layer provides additional conductivity paths without requiring excessive etching time on a single thick layer
2Reliability
If a thick copper layer is used to provide improved conductivity, then electrical conductivity is improved, but line space and line width must be increased
Solution Approach 1:
The conductive wiring is divided into two separate layers: a first conductive wiring layer formed by electroplating and a second conductive wiring layer formed by etching the copper substrate. These two layers work together to provide the required conductivity while allowing each layer to be optimized independently, enabling reduced line width and line space compared to using a single thick copper layer
Solution Approach 2:
Instead of increasing the thickness of a single copper layer (one-dimensional solution), the patent adds a vertical dimension by creating a two-layer conductive structure. The first conductive wiring layer (electroplated) and second conductive wiring layer (etched) are positioned at different heights, providing conductivity pathways in multiple dimensions while maintaining reduced line width and line space on the substrate surface
3Length of stationary object
If extended etching is used to form thick copper layer, then copper layer thickness is increased, but lateral etching occurs reducing precision
Solution Approach 1:
The conductive wiring is divided into two separate layers: a first conductive wiring layer formed by electroplating and a second conductive wiring layer formed by etching the copper substrate. These two layers work together to provide the required conductivity while allowing each layer to be optimized independently, avoiding the need for prolonged etching that causes lateral etching and precision loss
Solution Approach 2:
The first conductive wiring layer is formed by electroplating before the etching process. This preliminary electroplating creates a precise conductive pattern that protects the underlying substrate, allowing subsequent etching to proceed without causing lateral etching that would compromise the precision of the line space and line width
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for the formation of circuit boards with reduced line space and width, avoiding under etching and enabling improved conductivity while maintaining suitable thickness, thus enhancing the manufacturing efficiency and performance of circuit boards.
Implementation Method 1
the photoresist layer is exposed to light, the photoresist layer is oxidized
Implementation Method 2
The circuit board comprises a conductive wiring
Data Source
AI summary
A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.