Insulating Substrate Metal Adhesion Improvement TRIZ Cases
- PCB Conductor Trace with Low-Magnetism Metal Cover Layer
A printed circuit board conductor trace features a low-magnetism metal cover layer extending from terminal to wiring portions.
- Laminate with UV-Activated Polymer for Strong Metal Adhesion
A laminate structure uses UV light to activate a polymer layer, creating chemical bonds that secure metal layers without separation.
- Wiring Board Via Hole Surface Roughness Control
Differentiating via hole inner surface roughness from outer layer smoothness prevents etching residues that cause short circuits in narrow-pitch wiring.
- Wiring Substrate Mixed Layer Enhances Metal Wire Adhesion
A wiring substrate with a resin and catalyst mixed layer improves metal wire adhesion through embedded electroless plating.