Wiring Substrate Mixed Layer Enhances Metal Wire Adhesion
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Solution Overview
Problem
Existing methods for manufacturing wiring substrates using metal wires on resin substrates often result in insufficient adhesion of the metal wire to the substrate, as the ion catalyst is only applied to the surface rather than being embedded within the resin.
Innovation Solution
A method involving the application of a catalyst to the resin substrate, followed by laser irradiation to mix the resin and catalyst, creating a mixed layer where the metal plating is performed, ensuring the catalyst is both on the surface and embedded within the resin, thereby enhancing the adhesion of the metal wire.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the ion catalyst is applied only to the surface of the resin substrate, then the manufacturing process is simple, but the adhesion of the metal wire to the substrate is insufficient
Solution Approach 1:
The catalyst is applied to the resin substrate before laser irradiation, preparing the substrate in advance for the subsequent metal plating process. This preliminary catalyst application ensures that when the laser irradiates the substrate, the catalyst is already positioned to facilitate metal deposition, resolving the contradiction by preparing the surface beforehand rather than requiring complex in-situ catalyst generation
Solution Approach 2:
The patent changes the physical state and distribution of the catalyst by using laser irradiation to mix it into the resin substrate, transforming it from a simple surface coating to a mixed layer within the resin. This parameter change in catalyst distribution (from surface-only to mixed within resin) significantly improves metal wire adhesion while maintaining manufacturing simplicity
2Ease of manufacture
If the ion catalyst is brought into contact with the laser-modified surface, then the metal wire can be formed by electroless plating, but the adhesion remains insufficient because the catalyst is not embedded in the resin
Solution Approach 1:
The patent merges the catalyst application step with the laser irradiation step by applying the catalyst to the resin substrate before irradiation. The laser energy mixes the catalyst into the resin, combining the catalyst distribution function with the surface modification function. This merging ensures the catalyst is embedded in the resin during the metal plating process, significantly improving adhesion while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the adhesion of the metal wire to the substrate by using the catalyst both on the surface and embedded within the resin, improving the bonding strength and preventing electrical leaks between metal wires.
Implementation Method 1
irradiating a base body made of a synthetic resin and serving as a substrate with a laser beam to modify its surface
Implementation Method 2
irradiating the substrate with a laser beam to modify its surface
Implementation Method 3
bringing an ion catalyst into contact with the surface modified portion to provide electroless plating at the portion, thereby forming a metal wire
Data Source
AI summary
A wiring substrate includes a substrate containing a resin as a main component and including a mixed layer in which the resin and a catalyst are mixed together; and a metal wire disposed to cover the mixed layer and being in contact with the catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.