Patterned Conductive Structure via Soluble Resist and Laser Ablation
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Solution Overview
Problem
Existing methods for forming antenna elements using laser direct structuring technology often damage the substrate surface during etching and require special materials with catalysts, leading to increased costs and reduced mechanical properties.
Innovation Solution
A method involving the formation of a soluble layer on a substrate, followed by laser ablation to create rough portions, and subsequent physical vapor deposition of a conductive layer, which is then washed away with a non-aggressive solvent to create a patterned conductive structure without the need for special substrates or catalysts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser direct structuring technology with etching process is used to form antenna elements, then conductive patterns can be formed on substrates, but the substrate surface is damaged during the etching process
Solution Approach 1:
The patent extracts and removes the harmful etching process from the manufacturing sequence. Instead of using aggressive chemical etching that damages the substrate surface, the invention uses a water-soluble resist layer that can be cleanly removed by washing, thereby achieving conductive pattern formation without substrate surface damage.
Solution Approach 2:
The patent introduces a disposable water-soluble resist layer that serves its purpose during the deposition process and then is easily removed by washing. This temporary layer protects the substrate from damage while enabling precise conductive pattern formation, after which it is discarded through simple water rinsing.
2Manufacturing precision
If special substrates with catalysts are used for electroless plating process, then conductive patterns can be formed, but the costs increase and mechanical properties of substrates are reduced
Solution Approach 1:
The patent replaces the electroless plating chemical process with a physical vapor deposition process. Instead of relying on chemical catalysts embedded in the substrate, the invention uses physical deposition methods to form conductive patterns directly on the substrate surface, eliminating the need for special catalyzed substrates and preserving both mechanical properties and cost-effectiveness.
Solution Approach 2:
The patent introduces a water-soluble resist layer as an intermediary that enables precise conductive pattern formation without requiring the substrate itself to contain catalysts. This intermediary layer allows the use of standard, mechanically strong substrates while still achieving the desired conductive patterns through selective deposition.
3Manufacturing precision
If special substrates with catalysts are used for electroless plating process, then conductive patterns can be formed, but the production costs increase
Solution Approach 1:
The patent uses a inexpensive water-soluble resist layer as a temporary tool that enables precise conductive pattern formation and then is easily removed by water washing. This approach eliminates the need for expensive special substrates with embedded catalysts, significantly reducing material costs while maintaining manufacturing precision.
Solution Approach 2:
The patent replaces the expensive electroless plating process with a physical vapor deposition process that uses standard substrates. This substitution eliminates the need for costly catalyst-containing substrates and complex chemical processing, thereby reducing production costs while maintaining the ability to form precise conductive patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the use of general substrates with improved mechanical properties and lower costs, while maintaining the quality of the patterned conductive structure, and enables the selection of substrates based on laser absorption, without damaging the surface or requiring aggressive chemical treatments.
Implementation Method 1
A portion of the plating resist material within a predetermined region on the substrate is then removed and the catalyst in the predetermined region is activated through laser ablation
Implementation Method 2
A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening
Data Source
AI summary
A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.