Printed Circuit Board Antenna Air Gap Hybrid Bonding
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Solution Overview
Problem
Existing printed circuit boards for antennas face challenges in enhancing antenna performance, particularly in achieving a balance between reducing antenna size and increasing bandwidth, while maintaining effective material properties.
Innovation Solution
The solution involves creating a printed circuit board with an air gap structure by forming a first substrate with a first antenna pattern and a second substrate with a second antenna pattern, and then bonding them using hybrid metal bonding, which includes a metal layer and a bonding layer covering the side surfaces of the metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna size is reduced, then the device compactness is improved, but the bandwidth is reduced
Solution Approach 1:
The patent introduces an air gap structure that creates a three-dimensional configuration by separating the first and second antenna patterns vertically. This dimensional change allows the antenna to maintain reduced size while increasing bandwidth through the air gap's electromagnetic properties, resolving the trade-off between size reduction and bandwidth maintenance.
Solution Approach 2:
The patent uses a composite structure combining organic substrate materials with an air gap (effectively creating an air-organic composite). This composite approach allows the antenna to achieve both size reduction and bandwidth increase by leveraging the low dielectric constant of air while maintaining structural integrity through the organic substrate.
2Productivity
If the dielectric constant is reduced, then the bandwidth is increased, but the antenna size may increase
Solution Approach 1:
By introducing the air gap structure that creates vertical separation between antenna layers, the patent achieves bandwidth increase through dielectric constant reduction without proportional size increase. The three-dimensional arrangement allows compact footprint while maintaining the electromagnetic benefits of low dielectric constant.
Solution Approach 2:
The air gap is strategically positioned between specific antenna patterns where it provides local dielectric constant reduction. This localized application allows bandwidth enhancement in critical regions without requiring overall antenna size expansion, as the air gap's electromagnetic benefits are concentrated where most needed.
3Ease of manufacture
If conventional bonding methods are used, then the substrates can be bonded, but the bonding reliability is insufficient
Solution Approach 1:
The patent employs hybrid metal bonding that creates a composite bonding structure combining organic substrate materials with inorganic bonding layers. This composite bonding approach significantly enhances bonding reliability compared to conventional single-material bonding methods, while remaining manufacturable through established hybrid bonding processes.
Solution Approach 2:
The inorganic bonding layer acts as an intermediary between the organic substrate materials, enabling reliable bonding that neither organic material alone could achieve. This intermediate layer facilitates strong adhesion and electrical connection while maintaining compatibility with the organic substrates, resolving the reliability issue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively increases antenna performance by reducing the dielectric constant, allowing for a smaller antenna size with increased bandwidth, and improves bonding reliability while reducing the overall thickness of the substrate.
Implementation Method 1
bonding first and second substrates using hybrid metal bonding
Data Source
AI summary
A printed circuit board includes a first substrate including a first antenna pattern; a second substrate disposed on a first substrate and including a second antenna pattern; a metal layer disposed between the first and second substrates; and a bonding layer disposed between the first and second substrates. At least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, each of the first and second substrates includes an organic material, and the bonding layer includes an inorganic material.