Reversible Conformal Coating Bonding for Corrosive Environments
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Solution Overview
Problem
Conformal coatings, such as silicones, may exacerbate component failure in harsh environments due to solubility issues with corrosive gases, and reworking non-silicone coatings is challenging with aggressive solvents that can damage underlying materials.
Innovation Solution
A process for reversibly bonding a conformal coating material, like epoxy, to a dry film solder mask material using functional groups that allow for chemical reactions like Diels-Alder, enabling the coating to be removed without aggressive techniques and re-applied, providing protection against corrosive agents like sulfur.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicone conformal coatings are used to protect components in harsh environments, then protection against corrosive gases is provided, but the coating exacerbates component failure due to solubility of sulfur in silicones
Solution Approach 1:
The patent changes the chemical composition parameters of the conformal coating by using epoxy-based materials with specific functional groups (carboxyl, hydroxyl, or amine groups) instead of silicone materials. This parameter change eliminates the solubility issue with sulfur while maintaining protective functionality against corrosive gases in harsh environments.
2Ease of repair
If aggressive solvents are used to remove non-silicone conformal coatings for reworking, then the coating can be removed, but underlying materials are damaged
Solution Approach 1:
The patent incorporates removable functional groups into the conformal coating formulation before application. These functional groups are designed to degrade or become removable under specific conditions (such as exposure to mild solvents or thermal treatment), allowing the coating to be removed without requiring aggressive solvents that would damage underlying PCB materials.
Solution Approach 2:
The patent changes the chemical structure parameters of the conformal coating by incorporating specific functional groups that provide controlled removability. This allows the coating to be removed using mild, non-aggressive methods while maintaining strong adhesion during normal operation, thus protecting underlying materials from damage during reworking processes.
3Reliability
If conformal coatings are applied to protect electronics in harsh environments, then component failure is reduced, but reworking the coating is challenging
Solution Approach 1:
The patent incorporates removable functional groups into the conformal coating formulation before application. These functional groups are designed to become removable under specific conditions, allowing the coating to be easily removed for reworking after it has provided reliable protection during normal operation.
Solution Approach 2:
The patent creates a dynamic coating system where the chemical properties of the coating change under specific conditions. The coating maintains strong adhesion and protective properties during normal operation, but becomes removable when exposed to specific stimuli (such as mild solvents or thermal treatment), enabling easy reworking while maintaining reliability during service.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reversible bond allows for non-aggressive removal and reapplication of the conformal coating, extending product life by protecting components from corrosive agents and enabling reworking without damaging underlying materials.
Implementation Method 1
reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group
Implementation Method 2
The conformal coating material is reversibly bonded to the DFSM material via a cyclic compound
Data Source
AI summary
In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.