Wiring Substrate With Manganese Silicate Interface

Solution Overview

Problem

Existing electronic device packaging technologies face challenges in achieving high mechanical strength and reliable electrical connections, especially as devices become smaller and more densely packed, with current materials and methods struggling to maintain effective bonding and thermal management.

Innovation Solution

A wiring base plate featuring an insulating substrate made from an aluminum oxide-based and mullite-based sintered body with a metallization layer containing manganese and molybdenum compounds, along with silica, which is bonded to both surfaces of the substrate, enhancing the bonding strength and reliability of electrical connections while improving thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If aluminum oxide-based sintered body with magnesium compound is used as insulating substrate, then mechanical strength is improved, but bonding reliability with metallization layer deteriorates

Engineering Contradiction:

Improvemechanical strengthVSAvoidbonding reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent applies local quality by creating a first surface portion on the insulating substrate with different composition (higher aluminum oxide content, lower magnesium compound content) compared to the bulk material. This localized compositional change at the bonding interface improves bonding reliability with the metallization layer while the bulk material maintains its high mechanical strength properties.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining aluminum oxide and magnesium compound in specific proportions, with the magnesium compound content controlled to 0.1-10 mass% in the first surface portion. This composite structure allows optimization of both mechanical strength and bonding reliability through controlled material composition and distribution.

Inventive Principle:

Principle #40Composite materials

2Reliability

If metallization layer is bonded to insulating substrate for electrical connection, then electrical connectivity is improved, but mechanical strength of the assembly deteriorates

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmechanical strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies local quality by creating a first surface portion on the insulating substrate with different composition (higher aluminum oxide content, lower magnesium compound content) compared to the bulk material. This localized compositional change at the bonding interface improves bonding reliability with the metallization layer while the bulk material maintains its high mechanical strength properties.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining aluminum oxide and magnesium compound in specific proportions, with the magnesium compound content controlled to 0.1-10 mass% in the first surface portion. This composite structure allows optimization of both mechanical strength and bonding reliability through controlled material composition and distribution.

Inventive Principle:

Principle #40Composite materials

3Volume of moving object

If device density is increased for downsizing, then miniaturization is achieved, but mechanical strength deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidmechanical strength

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent applies parameter changes by precisely controlling the magnesium compound content within 0.1-10 mass% range and aluminum oxide content within 80-99.9 mass% range in the first surface portion. These parameter optimizations enable high mechanical strength to be maintained even in miniaturized devices with increased density.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining aluminum oxide and magnesium compound in specific proportions, with the magnesium compound content controlled to 0.1-10 mass% in the first surface portion. This composite structure allows optimization of both mechanical strength and bonding reliability through controlled material composition and distribution.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides increased mechanical strength, improved electrical connection reliability, and enhanced thermal management, enabling the fabrication of electronic devices with high long-term reliability and efficient high-frequency signal transmission.

Implementation Method 1

an insulating substrate made from an aluminum oxide-based sintered body and a metallization layer bonded to the insulating substrate

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentEP3588551B1Wiring substrate, electronic device package, and electronic device

Publication Date: 2022.02.09 KYOCERA CORP

Figure 1A~1B
Figure 2~3
Figure 4~5

AI summary

Provided are a wiring base plate and the like including an insulating substrate including a first surface portion including an aluminum oxide-based sintered body and a mullite-based sintered body; and a metallization layer including a second surface portion, the second surface portion containing at least one of a manganese compound and a molybdenum compound and being in contact with the first surface portion of the insulating substrate; wherein the second surface portion of the metallization layer and the first surface portion of the insulating substrate contain at least one of a manganese silicate phase and a magnesium silicate phase.