Laminate with UV-Activated Polymer for Strong Metal Adhesion
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Solution Overview
Problem
Existing methods for forming metal layers on flexible substrates face challenges in achieving strong adhesion, leading to potential separation and reduced durability, especially in applications requiring antibacterial or antifungal functions, and the formation of fine conductive patterns with high conductivity is complex and inefficient.
Innovation Solution
A laminate structure is developed with a metal layer chemically bonded to a polymer layer, utilizing a reactive surface formed by UV light on a fluorine-based polymer, allowing for strong adhesion and the use of a simple printing method to create fine conductive patterns with high conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal layer is formed on a flexible substrate using conventional methods (evaporation, sputtering, coating), then the metal layer can be deposited, but the adhesion between the metal layer and substrate is weak, leading to separation and reduced durability
Solution Approach 1:
The patent applies preliminary action by treating the substrate surface with UV irradiation or plasma before metal layer formation to create a reactive surface with enhanced adhesion properties. This pre-treatment modifies the substrate surface to ensure strong bonding with the subsequent metal layer, preventing separation and improving durability in flexible electronic devices
Solution Approach 2:
The patent employs composite materials by creating a multi-layer structure consisting of the substrate, intermediate layer (in some embodiments), and metal layer. This composite structure enhances the overall adhesion strength and durability, combining the advantages of different materials to achieve both flexibility and strong bonding
2Manufacturing precision
If conventional coating methods are used to form conductive patterns, then metal layers can be deposited, but the process is complex and inefficient for fine patterns
Solution Approach 1:
The patent replaces conventional mechanical coating and lithography processes with direct printing methods using metal nanoparticle inks. This substitution enables fine conductive patterns to be formed directly through printing techniques, simplifying the manufacturing process while achieving high pattern resolution and reducing process complexity
Solution Approach 2:
The patent utilizes parameter changes by controlling the size and distribution of metal nanoparticles in the ink formulation. By adjusting nanoparticle parameters (size, concentration, surface modification), the process achieves fine pattern resolution and high conductivity simultaneously, while maintaining process simplicity through direct printing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate achieves strong adhesion of the metal layer to the substrate, preventing separation and enabling the formation of fine conductive patterns with high yield and conductivity, suitable for flexible electronic devices and daily commodities.
Implementation Method 1
a reactive surface formed by UV light on a fluorine-based polymer
Data Source
AI summary
A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, the surface of the metal nanoparticles being protected by an organic molecule layer.