Multi-Layer Conductive Trace Corrosion Resistance
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Solution Overview
Problem
Conductive copper traces are prone to corrosion, leading to degradation and performance issues, and conventional production methods generate waste, require multiple steps, and result in visually apparent copper traces, which are not durable against wear and abrasion.
Innovation Solution
The development of multi-layered conductive traces comprising an interface layer, a conductive layer, a redox control layer, a precious metal layer, and a dielectric layer, which can be tailored to enhance adhesion, protect against corrosion, and provide aesthetic appeal, while being adaptable to various substrates and applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper traces are used for conductivity, then electrical conductivity is achieved, but corrosion resistance deteriorates
Solution Approach 1:
The patent applies composite materials by combining copper with multiple protective layers including nickel, chrome, and clear coat layers. This creates a composite structure where the copper provides electrical conductivity while the outer layers provide corrosion and oxidation resistance, resolving the contradiction between conductivity and corrosion resistance.
Solution Approach 2:
The patent uses intermediary protective layers (nickel layer, chrome layer) that act as mediators between the copper trace and the corrosive environment. These intermediate layers prevent direct contact between copper and corrosive agents like oxygen and moisture, thereby protecting the copper from corrosion while maintaining electrical conductivity.
2Manufacturing precision
If subtractive process is used to form traces, then thin copper traces are produced, but waste generation increases
Solution Approach 1:
The patent inverts the conventional subtractive approach by using an additive process. Instead of depositing copper everywhere and removing unwanted portions, the patent directly deposits copper only where traces are needed through electroforming, thereby eliminating copper waste while maintaining precise trace thickness control.
Solution Approach 2:
The electroforming process is self-service in nature, as the copper deposition occurs automatically in the pattern defined by the mask without requiring subsequent removal steps. The process inherently produces only the desired trace structure, eliminating the need for wasteful subtraction operations.
3Loss of substance
If additive process is used to form traces, then copper waste is reduced, but process complexity increases
Solution Approach 1:
The patent merges multiple operations into a unified electroforming process. The deposition, patterning, and thickness control are all achieved in a single electroforming step rather than requiring separate steps for copper deposition, etching, and finishing, thereby reducing process complexity while maintaining waste reduction benefits.
Solution Approach 2:
The electroforming process serves multiple functions simultaneously: it deposits copper, defines the trace pattern, controls trace thickness, and creates a ready-to-plate surface. This multi-functionality reduces the number of separate process steps needed compared to conventional additive methods, addressing the complexity issue.
4Reliability
If conventional protective coating is applied after trace formation, then corrosion protection is achieved, but production time and cost increase
Solution Approach 1:
The patent applies preliminary action by incorporating corrosion protection directly into the trace formation process itself. The electroformed copper surface is prepared during deposition to be ready for immediate plating, eliminating the need for separate surface preparation and coating steps that would add time and cost to the process.
Solution Approach 2:
The patent combines the trace formation and protective coating operations into a single integrated electroforming and plating process. The copper trace is formed and immediately plated with protective layers in sequence without interruption, merging what would traditionally be separate processes into one continuous operation, thereby reducing time and cost.
5Ease of manufacture
If single-layer copper trace is used, then production is simple, but durability against wear and abrasion deteriorates
Solution Approach 1:
The patent applies composite materials by creating a multi-layer structure consisting of copper trace, nickel layer, chrome layer, and clear coat. This composite structure maintains the simplicity of the electroforming production method while dramatically improving wear and abrasion resistance through the combined properties of each layer.
Solution Approach 2:
The patent segments the protective function into multiple distinct layers, each providing specific protection: copper for conductivity, nickel for corrosion resistance, chrome for hardness and wear resistance, and clear coat for environmental protection. This segmentation allows each layer to be optimized for its specific function while maintaining overall production simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layered conductive traces are more durable, easier to produce, and offer improved electrical conductivity, reducing corrosion and wear, while being economically viable and aesthetically appealing, with the ability to be adapted for specific uses and substrates.
Implementation Method 1
a redox control layer covering an exposed portion of the conductive layer
Data Source
Figure 1~2
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Figure 5~6
AI summary
The present subject matter provides for a multi-layer conductive trace. The trace can be formed by digital printing the individual layers and firing. The individual layers each impart functional characteristics to the conductive trace and each layer has components that can be adjusted to affect the performance characteristics of that particular layer without detrimentally affecting the performance characteristics of the remaining layers.