Semiconductor Circuit Breaker Layout for Compact Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor circuit breakers face challenges in efficiently dissipating heat within a limited space, particularly in direct current (DC) systems, while maintaining a compact size and facilitating easy maintenance.
Innovation Solution
The design includes a switching device and air gap switch in an upper space, a heatsink and cooling fan in a lower space, with a base plate dividing the enclosure into two levels, and ventilation holes positioned to enhance airflow for efficient heat dissipation and maintenance accessibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a semiconductor circuit breaker is designed with a compact structure to reduce occupying space, then the volume is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent transitions from a single-level planar layout to a multi-level three-dimensional structure by introducing a base plate that divides the enclosure into upper and lower spaces. The heatsink is positioned in the lower space directly beneath the switching device, creating vertical heat dissipation pathways that maximize space utilization while maintaining effective thermal management in a compact volume.
2Temperature
If ventilation holes are increased to improve heat dissipation, then cooling efficiency is improved, but structural integrity and sealing may deteriorate
Solution Approach 1:
The patent implements ventilation holes at specific strategic locations rather than uniformly across the enclosure. The first ventilation hole is positioned at the upper rear portion, the second at the lower rear portion, and the third at the lower front portion, creating localized airflow channels that optimize cooling efficiency while maintaining overall structural integrity through minimal, precisely-placed openings.
3Ease of repair
If components are made detachable to facilitate maintenance, then ease of repair is improved, but device complexity increases
Solution Approach 1:
The patent divides the internal components into distinct detachable modules: the switching device, air gap switch, and electric circuit are equipped on the upper portion of the base plate, while the heatsink and cooling fan are equipped on the lower portion. This segmentation allows independent removal and replacement of each module, significantly improving maintenance accessibility without requiring complete disassembly of the entire device.
Solution Approach 2:
The patent implements a dynamic, reconfigurable assembly structure where components can be easily attached and detached. The base plate serves as a common mounting platform that allows for quick assembly and disassembly of different component modules, enabling flexible maintenance operations while maintaining a relatively simple overall structure through standardized mounting interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves enhanced heat dissipation and reduced occupying space, with improved cooling effects and simplified maintenance through detachable components.
Implementation Method 1
a heatsink disposed in a lower space of the enclosure and coupled to a lower portion of the switching device
Implementation Method 2
a cooling fan disposed in the lower space and disposed in a front portion of the enclosure
Implementation Method 3
a cooling fan disposed in the lower space and disposed in a front portion of the enclosure
Data Source
AI summary
The present disclosure relates to a semiconductor circuit breaker, and more particularly, to a semiconductor circuit breaker having excellent heat dissipation. The semiconductor circuit breaker according to one embodiment of the present invention comprises: a switching device provided in an upper space of an enclosure; an air gap switch (mechanical switch) provided in the upper space and disposed forward of the switching device; an electric circuit disposed on an upper portion of the switching device; a heatsink provided in a lower space of the enclosure and coupled to a lower portion of the switching device; and a cooling fan provided in the lower space and disposed in a front portion of the enclosure.