Modifications For Power Electronics TRIZ Cases

See how dual-space heat insulation and compact heat exchange elements regulate control unit tem

Split airflow paths and a guided cover channel cool high-heat converter regions more effectively, improving overall thermal management.

A controlled switching layout simulates ATS fault scenarios with fewer AC sources, cutting test cost while improving power shelf test efficiency.

A two-level enclosure places the switch, heatsink, fan, and vents to improve DC breaker cooling in limited space while easing maintenance.

A dual-loop liquid cooling UPS uses a plate heat exchanger and pressure relief valve to remove most heat while reducing air-cooling space.

Vertical turbulent jet flow through finned manifold channels improves power module cooling while reducing flow loss and thermal imbalance.

A modular base combines five charging modules, magnetic docking, and wireless coils to cut cable clutter and save desktop space.

A shared temperature detector beside inverter and rectifier semiconductors speeds cooling abnormality detection while cutting sensor count, size, and cost.

Temperature-based coolant switching enables heat exchange only when transaxle-side coolant is hotter, improving target heating efficiency.

A combined liquid-and-air cooling layout uses ducts, a fan, pump, and heat exchanger to manage heat in compact power electronics enclosures.

Corona discharge drives ionic wind through a closed-loop pathway to cool electronics without fans, reducing weight and system complexity.

Corona discharge drives ionic wind to cool electronic equipment without fans, cutting weight, complexity, and failure points.

Adjustable airflow partitions balance cooling between AC and DC blocks, letting one UPS housing handle multiple installation specs.

Pre-cooling coolant in a series flow path improves power module temperature stability and reliability without changing module structure.

Individually adjusting refrigerant flow to each power converter improves temperature control while avoiding unnecessary cooling energy use.

Separating the processor and power converter on opposite PCB sides improves heat removal with dedicated cooling plates and conductive layers.

Directional microchannel and manifold layout improves cooling uniformity in multi-heat-source power modules while supporting higher power density.

Jet impingement directs cooling fluid onto thermally coupled surfaces to keep power electronics at optimal temperatures across varying loads.

A central coolant passage cools semiconductor switches on both compartment walls, saving enclosure space while improving heat dissipation.

Perpendicular semiconductor placement on upstream heat-sink airflow paths reduces pressure loss and temperature gradients in power conversion units.

Directing cooling jets into aligned recesses boosts power module heat transfer, cuts inlet-outlet temperature gaps, and helps prevent cracking.

A filtered two-stage air channel creates uniform pressure drop and airflow to cool converter semiconductors without higher fan noise.

Coordinated control of server and power supply fans uses temperature feedback to prevent air backflow and maintain effective heat dissipation.

AI-based thermal control predicts high-frequency power cycling to adjust fans and liquid cooling, reducing temperature swings and component wear.

AI/ML uses high- and low-frequency load data to adjust cooling ahead of power cycling, limiting temperature swings and component wear.

A three-mode fan circuit switches between load, temperature, and rated-speed operation to improve cooling and simplify fan diagnostics.

Offset power modules on an uneven heat sink base reduce upstream heat impact on downstream modules while preserving installation area.

An enclosure frame forms a sealable cavity around PCB components and pins to block corrosion while preserving air-cooled heat dissipation.

Isolation components separate adjacent cooling channels so a failed fan does not cause airflow loops, preserving heat dissipation efficiency.

Airflow guide members create auxiliary channels that cool power supply transformers more effectively without larger fans, extra noise, or added assembly cost.

Direct substrate bonding to a common heat sink reduces thermal interfaces, saves installation space, and improves gaseous cooling.

Wavy, expanding refrigerant channels promote boiling and cut two-phase pressure drop to keep power electronics at stable temperatures.

Detachable ducted cooling lets MMC cell modules be replaced individually outdoors while maintaining controlled air, insulation, and a smaller footprint.

Closed-loop dry-air recirculation through desiccant beds keeps sealed inverter housings below the dew point to prevent moisture damage.

Thermally driven fluid circulation in segmented closed-loop channels cools high-power electrical modules without pumps or precision heat-pipe geometry.

Alternating hot and cold channel segments create self-driven coolant flow that removes heat from high-power electrical modules with lower complexity.

Varying fin pitches and curved channels boost turbulence and convection, improving compact heat dissipation for high-power electronics.

By placing the cooling module above the power module, this case improves airflow separation and cooling in dense data center installations.

A sealed heat-dissipation cover uses conductive strips, fins, and a fan groove to cool circuit boards while blocking dust ingress.

An inlet cone and diverging air channel boost converter heat sink cooling while limiting fan noise, energy use, and dust ingress.

Interchangeable power modules and a heat-exchanging zone let one panel scale for solar, batteries, and EV charging without major rewiring.

Turbulence-generating members redirect passing air into railway coolers, suppressing separation vortices and improving cooling without elongating the housing.

An enclosure frame and sealant isolate exposed pins on air-cooled charging PCBs, limiting corrosion while preserving heat dissipation.

Isolation components separate each cooling channel so a failed fan cannot cause backflow loops that cut heat dissipation in neighboring power devices.

A heat sink nested in a housing groove preserves thermal conduction from the power module while reducing package size for compact power converters.

A partitioned outlet cover redirects heated air away from top components, improving convection cooling and reliability in power conversion equipment.

Protruding guide parts narrow the fan-to-plate gap, suppress internal air recirculation, and improve heat-sink cooling with short axial fans.

Direct fluid jets into recessed target surfaces to raise power module cooling efficiency, cut flow resistance, and limit inlet-outlet temperature gaps.

A nested two-housing fan mount hides exposed fasteners to prevent installation friction, vibration, and visual protrusions.

A baffled insert and cutout flow path spread coolant evenly across cooling-plate protrusions to reduce power module temperature variation.