Manifold Microchannel Heat Sink for Multi-Hotspot Temperature Uniformity
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Solution Overview
Problem
Traditional power electronic converters face challenges with heat dissipation due to high surface heat flux densities and temperature imbalances caused by inadequate consideration of temperature uniformity in multi-heat source systems, leading to reduced reliability and power density.
Innovation Solution
A manifold microchannel heat sink is designed with directional optimization of hotspot areas, incorporating a heat dissipation substrate, a cold source device, and a diverter manifold to enhance cooling efficiency by optimizing microchannel layout and fluid flow distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation design is used in multi-heat source systems, then the structure is simple, but temperature uniformity deteriorates causing temperature imbalance and reduced reliability
Solution Approach 1:
The patent applies local quality by designing different microchannel structures in different regions of the heat dissipation substrate. Specifically, the microchannels have varying densities and configurations in different areas to match the local heat generation characteristics of multiple heat sources, thereby achieving uniform temperature distribution across the substrate while maintaining a relatively simple overall structure.
Solution Approach 2:
The heat dissipation substrate is segmented into multiple regions with dedicated microchannel patterns for each heat source. The manifold structure divides the cooling fluid distribution into separate channels that can be independently optimized for each heat generating area, allowing targeted heat dissipation control without requiring complex external regulation systems.
2Loss of energy
If excessive cooling fluid is distributed in lower-temperature areas, then the heat sink structure is complete, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent implements dynamic fluid distribution through the manifold microchannel structure, where cooling fluid is dynamically directed to different regions based on local heat generation needs. The manifold design creates variable flow paths that automatically adjust fluid distribution, ensuring optimal cooling fluid placement in high-temperature areas while minimizing flow in lower-temperature regions, thereby maximizing heat dissipation efficiency without complex external control.
3Productivity
If power density is increased, then the converter size is reduced, but heat accumulation worsens causing higher failure rate
Solution Approach 1:
The patent employs hydraulic cooling through the manifold microchannel heat dissipation system, where cooling fluid is pumped through intricately designed microchannels that maximize surface area contact with heat sources. This hydraulic approach enables efficient heat removal from high-density power converters, allowing increased power density while maintaining acceptable temperature levels through enhanced convective heat transfer.
Solution Approach 2:
The patent transitions from conventional two-dimensional heat dissipation surfaces to three-dimensional manifold microchannel structures. The multi-layered manifold design creates vertical heat transfer paths and increases the effective heat exchange surface area within a compact volume, enabling efficient heat removal from high-density power converters without proportionally increasing the overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides directionally enhanced cooling and improved heat dissipation efficiency, reducing temperature non-uniformity and increasing power density by optimizing microchannel design and fluid flow, with the cold source device being either air-cooling or water-cooling.
Implementation Method 1
a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module
Implementation Method 2
the cold source device is spaced from the heat dissipation substrate and is configured to generate a cold flow and dissipate heat from the heat dissipation substrate
Implementation Method 3
the diverter manifold (4) is arranged between the heat dissipation substrate and the cold source device, communicates with the microchannel on the heat dissipation substrate to form a heat dissipation channel, and is configured to cooperate with the cold source device to perform directionally enhanced cooling on the heat dissipation substrate
Data Source
AI summary
The present disclosure relates to the technical field of heat dissipation for electronic devices, and discloses a manifold microchannel heat sink based on directional optimization of hotspot areas, including a power module, a heat dissipation substrate, a cold source device, and a diverter manifold; the heat dissipation substrate is arranged on the power module, a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module. According to the manifold microchannel heat sink based on the directional optimization of hotspot areas, the local heat dissipation performance of the power module may be preliminarily changed by optimizing the microchannel on the heat dissipation substrate, which avoids poor heat dissipation temperature uniformity in a multi-heat source system.