Shared Cooling Assembly for Multi-Compartment Power Enclosures
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Solution Overview
Problem
Existing thermal transfer structures in electrical power equipment, such as heatsinks and cooling systems, occupy significant space and face form factor constraints in confined enclosures, making efficient heat management challenging for heat-generating semiconductor devices.
Innovation Solution
A cooling structure with a coolant passage between compartments, featuring heatsinks and fans, that directs coolant flow parallel to opposing walls, allowing for efficient heat transfer and space utilization, with vents and ducts for air intake and exhaust, enabling effective cooling of semiconductor switches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heatsinks and cooling systems are used in electrical power equipment, then heat dissipation is achieved, but the equipment occupies significant space and faces form factor constraints in confined enclosures
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated cooling structure that serves multiple semiconductor devices simultaneously. The cooling assembly merges heatsink functionality, fan mounting, and coolant passage integration into one compact unit, reducing the total volume required for cooling systems in electrical power equipment.
Solution Approach 2:
The cooling structure is designed as a multi-functional assembly that can cool multiple semiconductor switches (IGBTs, MOSFETs, or diodes) located in different compartments. The single cooling assembly serves universal cooling purposes across various device types and locations, optimizing space utilization while maintaining effective heat dissipation.
2Temperature
If cooling structures are provided in confined spaces, then heat transfer is achieved, but form factor constraints arise from the need to provide heat transfer path to the exterior
Solution Approach 1:
The cooling structure is divided into multiple compartments or sections, each capable of cooling specific semiconductor devices. This segmentation allows the cooling system to adapt to complex enclosure geometries and provide heat transfer paths to multiple exterior surfaces, reducing the complexity of routing heat to a single external location.
Solution Approach 2:
The cooling assembly utilizes three-dimensional space efficiently by extending cooling capabilities in multiple directions and dimensions. The structure incorporates vertical and horizontal heat transfer paths, allowing heat to be dissipated through various surfaces of the enclosure, thereby overcoming form factor constraints associated with single-direction heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides efficient heat dissipation while optimizing space usage, allowing for compact designs that meet form factor requirements and effectively manage heat generated by semiconductor devices.
Implementation Method 1
A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow
Implementation Method 2
First and second semiconductor switches are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow
Implementation Method 3
The cooling structure may further include at least one fan disposed between the first and second walls and configured to generate the coolant flow
Data Source
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AI summary
An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.