Power Converter Housing With Nested Heat Sink for Miniaturization
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Solution Overview
Problem
Existing power conversion devices face challenges in miniaturization due to the space occupied by the heat sink and housing, which hinders efficient heat dissipation and increases device size.
Innovation Solution
The power conversion device incorporates a heat sink accommodated in an accommodation groove within the housing, allowing for improved space utilization and enhanced heat dissipation efficiency, while maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is stacked outside the housing, then heat dissipation efficiency is ensured, but the device size increases and miniaturization becomes difficult
Solution Approach 1:
The heat sink is nested within the housing structure by accommodating it in an accommodation groove formed on the housing. This allows the heat sink to be integrated into the housing volume rather than extending externally, thereby reducing the overall device size while maintaining heat dissipation functionality. The heat sink fits within the groove that extends along the first direction and has a first opening, enabling thermal management without increasing the device envelope.
Solution Approach 2:
The accommodation groove is designed to extend along the first direction (lengthwise) rather than requiring additional width or height. This dimensional reorientation allows the heat sink to be accommodated within the existing housing footprint by utilizing the length dimension, thereby achieving miniaturization in width and height while maintaining adequate heat dissipation surface area.
2Volume of stationary object
If the heat sink is accommodated in the accommodation groove, then space utilization is improved and device size is reduced, but heat dissipation efficiency may be compromised
Solution Approach 1:
The accommodation groove is designed with specific local characteristics: it extends along the first direction and has a first opening that provides thermal access. The groove dimensions and positioning are optimized to provide adequate thermal contact between the heat sink and the external environment while maintaining compact integration within the housing structure.
Solution Approach 2:
The housing structure serves multiple functions: it provides mechanical protection, structural support, and thermal management pathways. The accommodation groove integrated into the housing enables the heat sink to fulfill its heat dissipation function while the housing itself acts as part of the thermal management system, eliminating the need for separate external heat dissipation structures.
3Temperature
If both the heat sink and housing occupy separate spaces, then heat dissipation is effective, but the device complexity increases
Solution Approach 1:
The housing and heat sink accommodation structures are merged into a single integrated design. The accommodation groove is formed directly on the housing, combining the housing's protective function with the heat sink's thermal management function. This integration reduces the number of separate components and simplifies the overall device structure while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the device size and facilitates miniaturization by optimizing space utilization and heat dissipation, ensuring efficient thermal management and electrical connectivity.
Implementation Method 1
The heat sink is connected to the power module in a thermally conductive manner. Heat generated by the power module during operation is transferred out of the housing through the heat sink.
Data Source
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AI summary
This application provides a power conversion device. The power conversion device includes a housing, a power module, and a heat sink. The housing includes a first sub-housing and a second sub-housing. The first sub-housing includes an accommodation cavity. The accommodation cavity extends along a first direction and has an accommodation opening. Along the first direction, the second sub-housing is disposed on one side of the first sub-housing. The second sub-housing covers the accommodation opening and closes the accommodation cavity. The power module is accommodated in the accommodation cavity. Along the first direction, the heat sink is disposed on one side of the first sub-housing and backs the second sub-housing. The heat sink is connected to the power module in a thermally conductive manner. An accommodation groove is provided on one side of the first sub-housing. The accommodation groove extends along the first direction and has a first opening. The first opening of the accommodation groove backs the accommodation cavity along the first direction. The heat sink is accommodated in the accommodation groove. Because the heat sink is accommodated in the accommodation groove, space utilization of the housing is greatly improved while heat dissipation efficiency for the power module is ensured. This facilitates a miniaturization design for the power conversion device.