Server Fan Control to Prevent Power Supply Air Backflow

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Solution Overview

Problem

Existing server designs with rear-mounted system fans experience air backflow in power supply units, leading to increased airflow temperatures and reduced heat dissipation efficiency, which is exacerbated by increasing fan speeds to address temperature increases, further worsening the issue.

Innovation Solution

A method involving temperature sensors to monitor airflow and component temperatures, adjusting fan speeds through control data increments to maintain optimal airflow direction and prevent backflow, ensuring efficient heat dissipation by controlling first and second fans separately based on predetermined temperature ranges.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fan speed is increased to reduce component temperature, then heat dissipation effectiveness is improved, but air backflow in power supply units is worsened

Engineering Contradiction:
Improvecomponent temperatureVSAvoidair backflow
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent divides the fan control into separate independent control systems: system fans for general cooling and power supply fans for power supply unit cooling. Each fan type has its own control logic that monitors relevant temperature parameters and adjusts speed independently, preventing the air backflow issue that occurs when system fan speed is simply increased to cool power supply units.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The control method employs feedback mechanisms where temperature sensors monitor component temperatures and power supply unit temperatures separately. The control logic continuously adjusts fan speeds based on real-time temperature feedback, ensuring optimal cooling while preventing air backflow by maintaining appropriate pressure differentials through coordinated fan operation.

Inventive Principle:
Principle #23Feedback

2Temperature

If individual fan for power supply unit is added, then heat dissipation from power supply unit is improved, but device complexity is increased

Engineering Contradiction:
Improvepower supply unit temperatureVSAvoidfan control system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the control logic for system fans and power supply fans into a unified control method that operates as an integrated system. The control logic coordinates both fan types together, using a single control framework that manages multiple fans based on their respective temperature requirements, thereby reducing overall system complexity despite having multiple fans.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The control logic serves multiple functions: it controls system fans for general cooling, controls power supply fans for power supply unit cooling, and prevents air backflow through coordinated operation. This multi-functional control approach eliminates the need for separate complex control systems for each fan type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents air backflow in power supply units, maintains efficient heat dissipation, reduces energy waste, and ensures safer temperature control by optimizing fan speed controls in servers.

Implementation Method 1

a fan is usually provided in the server to generate airflow within the chassis to cool the electronic components by thermal convection

Methodology Applied
Scientific EffectThermal convection: Convection

Implementation Method 2

an individual fan may be provided for the power supply unit of the existing server to dissipate heat directly from the power supply unit

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS12563695B2Electronic device and heat dissipation method therefor
Publication Date: 2026.02.24 INVENTEC PUDONG TECH CORPOARTION
  • US12563695B2 patent drawing
  • US12563695B2 patent drawing

AI summary

Disclosed is a heat dissipation method for an electronic device. The electronic device includes a first fan and a power supply unit. The first fan generates airflow through the device. The power supply unit includes a second fan which generates airflow through the power supply unit. A speed of the first fan is controlled by a first current control data. A speed of the second fan is controlled by a second current control data. The control data of the first fan is determined according to the temperature control of electronic components of the server. The control data of the second fan is determined by considering that air backflow is generated in the power supply unit. The control data of the second fan is further determined by feeding back the control data of the first fan to the power supply unit and considering the temperature control of the power supply unit.