Staggered Power Module Layout on Heat Sink for Thermal Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power semiconductor devices face challenges in arranging power semiconductor modules with sufficient spacing, leading to downstream modules being affected by heat generated from upstream modules.
Innovation Solution
The design includes a case with an air passage, a heat sink with parallel fins, and power modules spaced along the air flow direction, with one module offsetting orthogonally to reduce thermal interference, and allows for flexible module arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power semiconductor modules are aligned obliquely to the cooling air flow direction, then the downstream modules are protected from upstream heat, but the modules cannot be arranged with sufficient spacing within the given installation area
Solution Approach 1:
The patent transitions from one-dimensional oblique alignment to two-dimensional staggered arrangement. Power modules are positioned at different longitudinal positions (along the air flow direction) and different transverse positions (orthogonal to air flow), creating a step-like pattern that increases spacing while maintaining compact footprint area.
Solution Approach 2:
The heat sink base is divided into multiple uneven surfaces at different longitudinal positions, with each surface supporting power modules at specific transverse positions. This segmentation allows independent positioning of modules to optimize both spacing and area utilization.
2Temperature
If power semiconductor modules are arranged with sufficient spacing to avoid heat interference, then downstream modules are protected from heat, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat sink base incorporates uneven surfaces with varying longitudinal positions and transverse offsets. These parameter variations are integrated into the heat sink base design, allowing standard manufacturing processes to produce the complex geometry while achieving optimal thermal management.
3Area of stationary object
If power semiconductor modules are closely arranged to maximize installation area utilization, then the device size is reduced, but downstream modules are affected by heat from upstream modules
Solution Approach 1:
The patent employs asymmetric positioning where power modules are arranged in a staggered pattern rather than symmetric alignment. This creates irregular spacing patterns that increase effective distance between modules while maintaining high area utilization, with modules positioned at different longitudinal and transverse coordinates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal interference, ensuring downstream modules receive lower-temperature air, effectively suppressing temperature increases and enhancing design freedom and productivity.
Implementation Method 1
The power semiconductor device reduces temperature increase in the power semiconductor modules by blowing cooling air along the arrayed fins of the heat sink
Implementation Method 2
An uneven surface is formed on the opposite face of the heat sink base. The power modules each include an uneven part engaging with the uneven surface of the heat sink base
Data Source
AI summary
A power semiconductor device includes a case including an air passage; a heat sink held by the case, with a plurality of fins disposed in the air passage; and a plurality of power modules. An uneven surface is formed on an opposite face of a heat sink base. The power modules each include an uneven part engaging with the uneven surface of the heat sink base and are spaced along a direction of an air flow, with the uneven parts fitted into the uneven surface of the heat sink base. One of an adjacent pair of the power modules in the direction of the air flow is disposed to offset in a direction orthogonal to the direction of the air flow relative to an other of the adjacent pair of the power modules.