Enclosure-Framed Electronic Components for Corrosion-Resistant PCB Cooling
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Solution Overview
Problem
Electronic devices with high-power circuit boards, such as charging circuit boards in charging piles for electric vehicles, face corrosion issues due to contaminants during air-cooled heat dissipation, especially affecting exposed pins and components, and conventional conformal coatings fail to adequately protect these areas.
Innovation Solution
The use of an enclosure frame with a cavity that seals the pin and electronic component, filled with a sealant to prevent exposure and corrosion, combined with a heat sink for effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooled heat dissipation is used on high-power circuit boards, then heat dissipation efficiency is improved, but contaminants are easily adsorbed onto the circuit board surface causing corrosion
Solution Approach 1:
The patent applies conformal coating as a thin film protective layer on the circuit board surface. This coating method provides protection against contaminant adsorption while maintaining the air-cooled heat dissipation structure, resolving the contradiction between heat dissipation efficiency and corrosion prevention
2Temperature
If a gap is reserved between the electronic component body and circuit board to extend heat conduction path, then heat impact on electronic component body is reduced, but the pin becomes partially exposed and more easily corroded
Solution Approach 1:
The patent applies conformal coating specifically to exposed pins and critical areas of the circuit board. This localized protective approach ensures that the gap needed for thermal management is maintained while the exposed pin surfaces are protected from corrosion through the conformal coating layer
3Object-affected harmful factors
If conformal coating is applied to cover exposed pins and high protruding components, then corrosion protection is improved, but it is difficult to ensure proper coating coverage on protruding surfaces and corners
Solution Approach 1:
The patent employs conformal coating technology that can conformally cover complex three-dimensional surfaces including protruding pins and corners. This coating method deposits protective material in a manner that follows the contours of the circuit board surface, ensuring uniform coverage on difficult-to-reach areas that traditional coating methods cannot adequately protect
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enclosure frame and sealant combination effectively protects the circuit board and components from corrosion, prolonging the device's service life and maintaining heat dissipation efficiency.
Implementation Method 1
heat dissipation processing is usually performed on these circuit boards in an air-cooled heat dissipation manner
Implementation Method 2
extend a heat conduction path between the electronic component body and the pad
Data Source
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AI summary
This application relates to the field of electronic device technologies, and provides an electronic component with an enclosure frame, a circuit board with an electronic component, and an electronic device, to effectively protect the circuit board from being corroded, thereby prolonging a service life of the electronic device. This application is applied to a charging pile for charging a new energy electric vehicle. An electronic component (32) with an enclosure frame includes an enclosure frame (33) and an electronic component (32). The enclosure frame (33) defines a cavity (34) that is closed or that has one open end; when the electronic component (32) with an enclosure frame is connected to a circuit board (3), the enclosure frame (33) and the circuit board (3) can define a cavity (34) that is closed or that has one open end; when the electronic component (32) with an enclosure frame is connected to a circuit board (3), the enclosure frame (33) and another enclosure frame (33) of another electronic component (32) with the another enclosure frame can define a cavity (34) that is closed or that has one open end; or when the electronic component (32) with an enclosure frame is connected to a circuit board (3), the enclosure frame (33), the circuit board (3), and another enclosure frame (33) of another electronic component (32) with the another enclosure frame can define a cavity (34) that is closed or that has one open end. The electronic component (32) includes an electronic component body (321) and a pin (322).