Isolated Cooling Channels to Prevent Fan Backflow in Power Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In existing energy storage systems, the interconnection of air outlets and inlets between heat dissipation channels of power devices leads to a backflow of gas, causing heat derating and reduced heat dissipation efficiency when one power device fails.
Innovation Solution
A heat dissipation apparatus with isolation components coupled to the air inlets and/or outlets of heat dissipation channels to prevent interconnection, ensuring that gas is either discharged externally or enters the channel through these components, thereby preventing backflow and maintaining efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If heat dissipation channels of multiple power devices are interconnected, then space utilization is improved, but heat dissipation efficiency deteriorates due to backflow when one device fails
Solution Approach 1:
The patent divides the heat dissipation system into independent segments by introducing isolation components (isolation plates or isolation structures) between adjacent heat dissipation channels. These isolation components physically separate the channels, preventing gas backflow while maintaining compact stacking. Each heat dissipation channel becomes an independent module with its own air inlet and air outlet, ensuring that failure of one device does not affect others.
Solution Approach 2:
The isolation component acts as an intermediary element between adjacent heat dissipation channels. It is positioned at the air inlet or air outlet of each channel to control gas flow direction. The intermediary structure allows normal channels to discharge gas externally while preventing backflow into failed channels, thus resolving the contradiction between space utilization and heat dissipation efficiency.
2Reliability
If isolation components are added to prevent backflow, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent employs thin plate-like isolation components (isolation plates) that are coupled to the air inlets or outlets of heat dissipation channels. These thin film structures provide effective flow isolation without adding significant bulk or complexity. The isolation plates can be简单地 installed and removed, maintaining ease of assembly and disassembly while preventing gas backflow.
Solution Approach 2:
The isolation component serves multiple functions simultaneously: it isolates adjacent heat dissipation channels, guides gas flow direction, and can be integrated with the housing structure. This multi-functionality reduces the need for additional separate components, thereby minimizing the increase in device complexity while achieving reliable heat dissipation.
3Ease of manufacture
If air outlets of adjacent heat dissipation channels are interconnected, then manufacturing is simplified, but gas backflow occurs causing heat derating
Solution Approach 1:
The isolation components are pre-installed or pre-integrated into the heat dissipation channel structure during manufacturing. This preliminary action ensures that when multiple power devices are stacked, the isolation is already in place, preventing gas backflow from the outset. The isolation plates are positioned to align with the air inlets or outlets, creating immediate flow separation without requiring additional assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the formation of loops between working and non-working fans, ensuring continuous heat dissipation and improved efficiency by isolating air flows, thus maintaining optimal operating conditions.
Implementation Method 1
a cooler fan in the heat dissipation channel continuously leads external air into the power device through an air inlet
Implementation Method 2
Components of the power device exchange heat with air in the heat dissipation channel by using a channel wall body
Data Source
AI summary
A heat dissipation apparatus includes at least two heating components, at least two fans, and at least two isolation components. Heat dissipation channels are disposed inside the at least two heating components, and a fan is provided in each heat dissipation channel. An isolation component is coupled to an air inlet and/or an air outlet of the heat dissipation channel. The isolation component may isolate an air inlet or air outlet of each heating component from an air inlet or air outlet of another heating component, so as to avoid forming a loop between a heat dissipation channel in which a working fan is located and a heat dissipation channel in which a non-working fan is located.